Semiconductor material smashing device and method adopting low-temperature intervention
A pulverizing device and semiconductor technology, used in grain processing and other directions, can solve the problems of difficult pulverization process, high hardness of semiconductor materials, and large pulverizing space, saving labor, improving pulverizing efficiency, and reducing agglomerated particles.
Active Publication Date: 2021-05-25
东和半导体设备研究开发(苏州)有限公司
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Problems solved by technology
[0011] Aiming at the deficiencies of the prior art, the present invention provides a semiconductor material crushing device and method using low temperature intervention, which solves the existing semiconductor material crushing process. The hardness of the semiconductor material itself is relatively high, which makes it difficult to carry out the subsequent crushing process. The efficiency is low, the precision of crushing is low, the space for crushing is large, and the problem of manual cutting is required
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[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0043] see Figure 1-4 , the embodiment of the present invention provides a technical solution: a semiconductor material crushing device using low temperature intervention, including a first chassis 1 and a second chassis 2 arranged side by side from left to right, the right side of the top of the second chassis 2 The primary crushing mechanism 3 is arranged on the side, and the bottom of the inner wall of the first chassis 1 is provided with a low-temperature...
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The invention discloses a semiconductor material smashing device and method adopting low-temperature intervention, and relates to the technical field of semiconductor material processing. The semiconductor material smashing device comprises a first bottom frame and a second bottom frame which are arranged side by side from left to right, a primary smashing mechanism is arranged on the right side of the top of the second bottom frame, a low-temperature intervention mechanism is arranged at the bottom of the inner wall of the first bottom frame, and the two sides of the upper portion of the inner wall of the first bottom frame are rotationally connected with rotating shafts. According to the semiconductor material smashing device and method adopting low-temperature intervention, the primary smashing mechanism is arranged on the right side of the top of the second bottom frame, the low-temperature intervention mechanism is arranged at the bottom of the inner wall of the first bottom frame, a semiconductor material can be subjected to embrittlement treatment in advance through a low-temperature box, a condenser, a control box and a wire in the low-temperature intervention mechanism, the follow-up smashing process is easier to carry out, the primary smashing mechanism is matched to carry out the reciprocating rolling process in the crushing box and the primary smashing process of the semiconductor material, the smashing time is shortened, and the smashing efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor material processing, in particular to a semiconductor material crushing device and method using low temperature intervention. Background technique [0002] Semiconductors refer to materials whose conductivity is between conductors and insulators at room temperature; semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. . [0003] Referring to the Chinese patent, a semiconductor material crushing device (publication number: CN206996775U, publication date: 2018-02-13), the semiconducting material crushing device, by setting a grinding disc, a grinding plate, protrusions and grooves, achieves the semiconductor Grinding and crushing of materials, grinding and crushing makes the crushing more thorough, and it is brok...
Claims
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IPC IPC(8): B02C19/18B02C1/00B02C23/00
CPCB02C19/186B02C1/00B02C23/00
Inventor 吴银雪
Owner 东和半导体设备研究开发(苏州)有限公司