Automatic quantitative insulating glue supplementing device for production of aluminum substrate

Abstract

The invention discloses an automatic quantitative insulation glue supplementing device for the production of an aluminum substrate. The device comprises a pressing glue supplementing bearing mechanism and a limiting, fixing and clamping mechanism, and the limiting, fixing and clamping mechanism is mounted at the bottom end of the pressing glue supplementing bearing mechanism. According to the glue supplementing device, when glue supplementing is conducted on a printing screen plate installed below a glue supplementing equipment pump body through a discharging assembly, the depth of the part, stretching into a discharging pipe, of a blocking panel can be flexibly adjusted according to the specific hole number of the surface of the screen plate and the glue supplementing demand quantity, since three sets of discharging cavities are mutually independent and consistent in structural dimensions, the width of each set of discharging cavity can be measured in advance before glue supplementing, when the glue supplementing amount is small, a holding rod can be adopted to push the blocking panel to move the depth of two sets of discharging cavities into the discharging pipe, the third discharging cavity and the second discharging cavity are sequentially blocked through the blocking panel, only the first discharging cavity is used for discharging, the excessive situation is avoided, and compared with conventional glue supplementing equipment, glue supplementing is quantitative, controllable and more accurate.

Description

technical field [0001] The invention relates to the technical field of aluminum substrate production devices, in particular to an automatic quantitative glue replenishment equipment for insulating glue used in aluminum substrate production. Background technique [0002] Aluminum substrates generally refer to aluminum-based copper-clad laminates with good heat dissipation functions. Generally, a single-sided panel consists of a three-layer structure, which is a circuit layer, an insulating layer, and an aluminum base layer. The double-sided board structure is a circuit layer, an insulating layer, an aluminum base, an insulating layer, and a circuit layer. Aluminum substrate, commonly used in LED lighting products. In the existing technology for producing aluminum substrates, it is necessary to make a thermally conductive adhesive film first, and then press the thermally conductive adhesive film with the pre-prepared aluminum plate and copper clad laminate to form the aluminu...

AI Technical Summary

Problems solved by technology

[0003] The existing equipment has uneven glue layer and holes on the surface of the stencil in the process of making the glue layer. Regular glue replenishment is required. Excessive glue will occur during the glue replenishment process, which will affect the performance and production of the thermal insulation layer. Printing mesh Relative displacement is easy to occur during glue replenishment, and the colloid is easy to solidify in the glue storage container, which affects the glue replenishment efficiency

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