Method and device for growing silicon carbide crystal by pvt method
A technology of silicon carbide and crystal growth, which is applied in the field of growing silicon carbide crystals by PVT method, which can solve the influence of the uniform stability of the temperature field at the seed crystal, increase the probability of polytype and inclusion generation, disrupt the orderly transmission of silicon carbide atmosphere, etc. problem, to achieve the effect of improving effective utilization, reducing thickness difference, and improving thickness uniformity
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Embodiment 1
[0064] refer to Figure 1-4 , this embodiment provides a crystal growth device, the device includes a crucible 1, a holding cylinder 2 and a furnace body, the bottom of the crucible 1 is used for placing silicon carbide raw materials, and the top of the crucible 1 is used for setting seed crystals; the holding cylinder 2 has A hollow cavity with one end open and the other closed; the crucible 1 is placed in the hollow cavity; the top of the heat preservation cover 3 is provided with a heat dissipation hole 31, the heat preservation cover 3 is arranged at the opening of the heat preservation cylinder 2, and the side wall of the heat preservation cover 3 is connected to the heat preservation cylinder. The top side wall of 2 abuts, and the heat preservation cover 3 can move along the top side wall of the heat preservation cylinder 2. The heat preservation cover 3 is provided with a heat dissipation hole 31; the furnace body is used for placing the crucible 1 and the heat preservat...
Embodiment 2
[0080] A method for growing silicon carbide crystals using the device described in Embodiment 1, the method comprising the steps of:
[0081](1) Assembly stage: the seed crystal is placed on the top of the crucible, and the silicon carbide raw material is filled at the bottom of the crucible; the crucible and the heat preservation cylinder are assembled, the assembled crucible is placed in the furnace body of the crystal growth furnace and sealed, and the bottom of the heat preservation cover is sealed. The distance from the top cover of the crucible is L, and L is 10-300mm;
[0082] (2) Impurity removal stage: vacuum the furnace body to 10 -6 Below mbar, then pass high-purity inert gas to 300~500mbar, repeat this process 2~3 times, and finally vacuum the furnace body to 10 -6 Below mbar;
[0083] (3) Heating stage: control the temperature of the first temperature measuring device at the top center of the crucible to rise to T1 and synchronously increase the pressure to P1, ...
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