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Multilayer ceramic electronic component and manufacturing method thereof

A technology for electronic components and multi-layer ceramics, applied in the field of multi-layer ceramic electronic components and their manufacturing, can solve problems such as deterioration of electrical properties, difficulty in removing carbon compounds, hindering interface bonding, cracking or delamination, etc.

Pending Publication Date: 2021-06-18
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, even with the binder removal process described above, it can be very difficult to completely remove carbon compounds
When a transition metal having high carbon solubility is used as a material of the internal electrode, a carbon layer is formed on the surface of the transition metal to deteriorate electrical characteristics
In addition, such a carbon layer may hinder bonding between interfaces to cause cracking or delamination, and may serve as a permeation path for external moisture, etc.

Method used

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  • Multilayer ceramic electronic component and manufacturing method thereof
  • Multilayer ceramic electronic component and manufacturing method thereof
  • Multilayer ceramic electronic component and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] The pieces used in the following samples were those in which a ceramic body corresponding to a 3225 size (for example, L=3.2mm×W=2.5mm) was barrel ground. After placing each of the samples on an alumina substrate having a size of 4.0×4.0 cm, it was put into a quartz tube inside the furnace. Then, heat treatment was performed under the conditions shown in Table 1.

[0062] Table 1

[0063]

[0064] sccm means standard cubic centimeter per minute (standard cubic centimeter per minute)

[0065] Table 2

[0066]

[0067]

[0068] Table 2 shows the characteristics of the samples after performing heat treatment under the conditions of Table 1. In Table 2, the number of layers of carbon was calculated using LabRamHR-800 (Raman spectrometer manufactured by HORIBA Corporation, Japan). In addition, long-term reliability was checked by determining whether a failure occurred when a voltage of 1.5 V was applied at a temperature of 85° C. and a relative humidity (RH) of ...

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Abstract

The invention provides a multilayer ceramic electronic component and a manufacturing method thereof. The multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0169619 filed with the Korean Intellectual Property Office on December 18, 2019, the entire disclosure of which is hereby incorporated by reference for all purposes . technical field [0002] The present disclosure relates to a multilayer ceramic electronic component and a manufacturing method thereof. Background technique [0003] With the recent trend of miniaturization of electronic products, demand for multilayer ceramic electronic components that are miniaturized while having high capacitance has increased. Such a multilayer ceramic electronic component is generally manufactured by mixing a ceramic raw material with a solvent, a binder, etc. to prepare a slurry and coating a thin film of the slurry to form a ceramic green sheet. Ceramic green sheets and sheets printed with internal electrodes are laminated alternately, and then a binder removal process and a sintering proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/005H01G4/30
CPCH01G4/30H01G4/005H01G4/012H01G4/232H01G4/2325H01G4/40H01G4/1209H01G4/0085
Inventor 尹炯悳宋永训申东辉兪洗莹李侑燮
Owner SAMSUNG ELECTRO MECHANICS CO LTD