Multilayer ceramic electronic component and manufacturing method thereof
A technology for electronic components and multi-layer ceramics, applied in the field of multi-layer ceramic electronic components and their manufacturing, can solve problems such as deterioration of electrical properties, difficulty in removing carbon compounds, hindering interface bonding, cracking or delamination, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0061] The pieces used in the following samples were those in which a ceramic body corresponding to a 3225 size (for example, L=3.2mm×W=2.5mm) was barrel ground. After placing each of the samples on an alumina substrate having a size of 4.0×4.0 cm, it was put into a quartz tube inside the furnace. Then, heat treatment was performed under the conditions shown in Table 1.
[0062] Table 1
[0063]
[0064] sccm means standard cubic centimeter per minute (standard cubic centimeter per minute)
[0065] Table 2
[0066]
[0067]
[0068] Table 2 shows the characteristics of the samples after performing heat treatment under the conditions of Table 1. In Table 2, the number of layers of carbon was calculated using LabRamHR-800 (Raman spectrometer manufactured by HORIBA Corporation, Japan). In addition, long-term reliability was checked by determining whether a failure occurred when a voltage of 1.5 V was applied at a temperature of 85° C. and a relative humidity (RH) of ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| length | aaaaa | aaaaa |
| length | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


