Film forming device, film forming method, and method for manufacturing electronic device

Abstract

The invention provides a film forming device, a film forming method, and a method for manufacturing an electronic device, wherein the reduction of the adsorption force caused by the relative position deviation of an electrostatic chuck and a substrate when the electrostatic chuck is adsorbed to the electrostatic chuck is suppressed. The film-forming device forms a film on a substrate with a film-forming material interposed therebetween, and includes: a first substrate support part disposed in a chamber and supporting a peripheral edge part of a first side of the substrate; a second substrate supporting part which is arranged in the chamber and supports a peripheral edge part of a second side opposite to the first side; a substrate suction member disposed above the first and second substrate support parts in the chamber and configured to suck a substrate; a position adjusting part which is used for aligning the substrate adsorption part and the substrate; and a control part that controls the first and second substrate supporting parts to move up and down toward the substrate suction member. After the control part raises at least one of the first and second substrate supporting parts toward the substrate suction member and before the start of suction of the substrate, the position adjustment member aligns the substrate suction member and the substrate.

Description

technical field [0001] The present invention relates to a film forming device, a film forming method and a manufacturing method of an electronic device. Background technique [0002] In the manufacture of an organic EL display device (organic EL display), when forming an organic light-emitting element (organic EL element; OLED) constituting an organic EL display device, the vapor deposition material evaporated from the evaporation source of the film forming device is formed through the deposition material. A mask with a pixel pattern is vapor-deposited on the substrate, thereby forming an organic layer and a metal layer. [0003] In the film-forming device of the upward vapor deposition method (deposition), the evaporation source is installed in the lower part of the vacuum container of the film-forming device, the substrate is arranged in the upper part of the vacuum container, and the lower surface of the substrate is vapor-deposited. In such an upward vapor deposition me...

AI Technical Summary

Problems solved by technology

[0005] However, when the electrostatic chuck is used to adsorb the substrate below supported by the substrate support portion from above, if the relative position of the electrostatic chuck and the substrate is shifted, the adsorption force may decrease.

[0006] For example, if a transport error occurs when the transport robot transports the substrate into the film formation chamber, the adsorption force may decrease due to such a relative positional shift.

Additionally, if Figure 6 As shown, in order to suppress the occurrence of wrinkles caused by the deflection of the central portion of the substrate S when it is adsorbed to the electrostatic chuck 240, it is being considered to sequentially raise the substrate support portions 220 that respectively support the peripheral portions on both sides of the substrate S facing each other. The substrate S is brought into contact with the electrostatic chuck 240, but in this case, when one substrate supporting portion is raised first, the substrate S is shifted to the opposite side as shown by the white arrow, and there is a gap between the electrostatic chuck 240 and the electrostatic chuck 240. Possibility of position shift between

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