Cleaning device and grinding device
A cleaning device and cleaning tank technology, applied in grinding devices, grinding machine tools, grinding machines, etc., can solve problems such as WPH that cannot be expected
Pending Publication Date: 2021-06-29
EBARA CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
In the existing structure where a series of cleaning processes cannot be performed due to prolongation of loss of time (OHT) due to this, improvement of WPH (Wafer per hour: throughput per hour) and improvement of cleaning performance cannot be expected
Method used
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Embodiment Construction
[0066] A cleaning device according to a first aspect of the embodiment includes:
[0067] A cleaning tank, which defines a cleaning space for cleaning the wafer;
[0068] a wafer rotation mechanism, which is disposed inside the cleaning tank and holds and rotates the wafer;
[0069] a cleaning part, which is in contact with the surface of the wafer and cleans the surface of the wafer, which is rotatable around a central axis extending in the lateral direction, and whose length in the axial direction is longer than that of the wafer The radius is long;
[0070] a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank, thereby moving the cleaning member from a evacuation position on the outside of the wafer to cleaning directly above the wafer; Location;
[0071] a second cleaning member for cleaning the surface of the wafer; and
[0072] a second swing mechanism for swinging the second cleaning member around a second swing axis ...
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A cleaning device and a grinding device are disclosed. The cleaning device includes: a cleaning tank defining a cleaning space for cleaning a wafer; a wafer rotating mechanism which is disposed on the inner side of the cleaning tank, holds the wafer, and rotates the wafer; a cleaning member that is in contact with the surface of the wafer and cleans the surface of the wafer, is rotatable about a central axis extending in the lateral direction, and has a length in the axial direction longer than the radius of the wafer; a swing mechanism that enables the cleaning member to swing around a swing axis on the inner side of the cleaning tank, so that the cleaning member moves to a cleaning position right above the wafer from an avoiding position on the outer side of the wafer; a second cleaning member that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning member around a second swing axis located inside the cleaning tank and passes directly above the center of the wafer.
Description
technical field [0001] The invention relates to a cleaning device and a grinding device. Background technique [0002] In the manufacturing process of a semiconductor device, various processes such as film formation, etching, and polishing are performed on the surface of a substrate such as a semiconductor wafer. Before and after these various treatments, since it is necessary to keep the surface of the substrate clean, cleaning of the substrate is required. In the cleaning process of a substrate, a cleaning machine is widely used, which rotates the substrate by driving the rollers while holding the peripheral portion of the substrate by a plurality of rollers, and cleans the rotating substrate by pressing a cleaning member. [0003] Japanese Unexamined Patent Application Publication No. 11-238713 (Patent Document 1) discloses a roller cleaning machine using a roller-shaped sponge as a cleaning member. The cleaning machine of Patent Document 1 has a megasonic nozzle at a p...
Claims
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IPC IPC(8): B24B37/04B24B37/34B08B11/00B08B1/02B08B3/02B08B13/00
CPCB24B37/04B24B37/34B08B11/00B08B1/02B08B3/022B08B13/00B24B7/228B08B1/04B08B3/024H01L21/67051H01L21/6719H01L21/68728H01L21/67046H01L21/67092H01L21/68764H01L21/67259H01L21/67219H01L21/67253
Inventor 宫崎充藤本友章深谷孝一及川文利井上拓也
Owner EBARA CORP