Automatic cutting and pasting equipment for heat conduction pad and using method

Abstract

The invention discloses automatic cutting and pasting equipment for a heat conduction pad and a using method. The automatic cutting and pasting equipment for the heat conduction pad comprises a PVC cutting-resistant rubber pad for placing the heat conduction pad, a measurement substrate for placing a PCB or a heat dissipation plate, a CCD camera, an XYZ module, an ultrasonic cutting device and a vacuum suction device. The CCD camera is mainly used for automatically identifying the size, the shape and the position of the heat conduction pad and the position where the heat conduction pad needs to be pasted, the XYZ module drives the CCD camera to shoot right above the PCB or the heat dissipation plate on the measurement substrate and automatically identify the position where the heat conduction pad needs to be pasted, and the XYZ module drives an ultrasonic cutting knife to cut the heat conduction pad with the corresponding size and thickness. The vacuum suction device sucks the cut heat conduction pad, and the heat conduction pad is driven by the XYZ module to move to the corresponding position and is automatically pasted.

Description

【Technical field】 [0001] The invention belongs to the technical field of machinery, and in particular refers to an automatic cutting and sticking equipment for a heat conduction pad applied in Surface Mount Technology (SMT). 【Background technique】 [0002] With the improvement of computing power and the reduction of physical size of electronic equipment in weapons and equipment, the temperature control of the chip as one of its components has become one of the key elements to be considered in product design. The increase in temperature will lead to problems such as slowing down the operation speed of the equipment, increasing the probability of chip failure, and even burning out the device, which directly threatens the product design function. In order to effectively control the temperature of the chip, a thermally conductive filling material, that is, a thermally conductive silicone pad (called a thermally conductive pad), is widely used in electronic and electrical product...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an automatic cutting and pasting equipment and method for thermal pads to solve the problem of extremely low operating efficiency, heavy workload and serious impact on product delivery progress and problems caused by manual cutting and pasting in the prior art. product quality problems

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