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Arrangement structure for communication device and electronic device including the same

A technology of electronic devices and wireless communication devices, which is applied in the direction of telephone communication, telephone structure, radiation element structure, etc., to achieve the effect of preventing the increase of processing capacity, preventing the increase of cost, and enhancing the radiation performance

Pending Publication Date: 2021-07-09
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Network capacity is stretched to the limit as content usage increases rapidly

Method used

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  • Arrangement structure for communication device and electronic device including the same
  • Arrangement structure for communication device and electronic device including the same
  • Arrangement structure for communication device and electronic device including the same

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Embodiment Construction

[0028] discussed below Figures 1 to 11BThe various embodiments used to describe the principles of the disclosure in this patent document are illustrative only and should not be construed in any way as limiting the scope of the disclosure. Those skilled in the art will understand that the principles of the present disclosure may be implemented in any suitably arranged system or device.

[0029] figure 1 is a block diagram illustrating electronic devices in a network environment according to various embodiments of the present disclosure.

[0030] refer to figure 1 , the electronic device 101 in the network environment can communicate with the electronic device 102 via the first network 198 (eg, a short-range wireless communication network), or communicate with the electronic device 104 or a server via the second network 199 (eg, a long-range wireless communication network) 108 communications. According to an embodiment, the electronic device 101 may communicate with the ele...

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Abstract

According to various embodiments, an electronic device includes: a housing including: a front surface plate; a rear surface plate facing toward the opposite direction of the front surface plate; and a side surface member surrounding a space between the front surface plate and the rear surface plate, the side surface member having a substantially rectangular shape when viewed above the front surface plate; a first PCB arranged in the space; a first wireless communication circuit; a substrate; a first antenna array protruding from the first side of the substrate toward the first portion; a second antenna array protruding from the second side of the substrate toward the second portion; and a second wireless communication circuit. Various other embodiments are possible.

Description

[0001] This application is a divisional application of a Chinese invention patent application with a filing date of November 27, 2018, application number 201811432573.6, and an invention title of "arrangement structure for communication devices and electronic devices including the same". technical field [0002] Various embodiments of the present disclosure relate to arrangements for communication devices and electronic devices including the same. Background technique [0003] With the development of wireless communication technology, electronic devices (for example, electronic devices for communication) are commonly used in our daily life, and thus, the use of content is increasing exponentially. As content usage rapidly increases, network capacity is stretched to the limit. Since low-latency data communication is required, it may be necessary to introduce next-generation wireless communication technology (eg, 5G communication) or high-speed wireless communication such as W...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02H01Q1/24H01Q21/28
CPCH04M1/026H04M1/0277H01Q1/243H01Q21/28H01Q21/067H01Q21/062H01Q21/065H04M1/0249H04B1/38H01Q1/38H01Q1/245H01Q9/0407
Inventor 李钟赫朴世铉千载奉
Owner SAMSUNG ELECTRONICS CO LTD