COB packaged QSFP28 optical module

Abstract

The invention discloses a COB packaged QSFP28 optical module, which comprises a storage stacking box, wherein a COB packaging device comprises an aluminum substrate, the top part of the aluminum substrate is bonded with an insulating layer through an adhesive, the top part of the insulating layer is bonded with a circuit layer through an adhesive, the top part of the circuit layer is bonded with a bonding wire through an adhesive, the top part of the storage stacking box is bonded with a QSFP optical module chip through an adhesive. The COB packaged QSFP28 optical module relates to the technical field of chip packaging. According to the COB packaged QSFP28 optical module, the packaging glue and the wall glue are arranged, so that the built-in chip of the QSFP28 optical module can perform COB packaging on the QSFP28 optical module chip and the circuit layer through utilizing the packaging glue in cooperation with the wall glue, effective soft protection can be performed on the QSFP28 optical module chip and the circuit layer, dustproof protection can be performed on the QSFP28 optical module chip and the circuit layer at the same time, and the problem that the QSFP28 optical module chip is collided and worn because the QSFP28 optical module chip is prone to be collided by the outside or the inner wall of the packaging device is solved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a COB packaged QSFP28 optical module. Background technique [0002] The optical module is composed of optoelectronic devices, functional circuits and optical interfaces. The optoelectronic devices include two parts: transmitting and receiving. Simply put, the function of the optical module is to convert electrical signals into optical signals at the sending end. It converts optical signals into electrical signals, and the QSFP28 optical module in the optical module can be said to be a new generation of optical modules. It is loved by many manufacturers because of its advantages such as small size, high port density, and low power consumption. It is a 100G optical module, which is an important part of the 100G network, and is mainly used in 100G Ethernet applications. The QSFP28 optical module uses an MTP interface. When it is used with OM3 multimode fiber, the transmission...

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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a COB-packaged QSFP28 optical module, which solves the problem that the built-in chip of the existing QSFP28 optical module is easily impacted by the outside or the inner wall of the packaging device, and at the same time, it is easy for dust to enter the QSFP28 optical module chip problem on circuit board

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