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Polyimide film having improved thermal conductivity and preparation method therefor

A technology of polyimide film and polyimide acid, which is applied in the field of polyimide film and its preparation, can solve the problems of poor dispersion of thermally conductive materials, reduced mechanical properties, and appearance defects of polyimide film And other issues

Pending Publication Date: 2021-07-23
PI ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in order to improve the thermal conductivity in the thickness direction of the polyimide film to a useful level, it is necessary to use a relatively high content of the thermally conductive material, and at this time, the prepared polyimide film may exhibit brittleness. , at the same time, may also be accompanied by a decrease in mechanical pro

Method used

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  • Polyimide film having improved thermal conductivity and preparation method therefor
  • Polyimide film having improved thermal conductivity and preparation method therefor
  • Polyimide film having improved thermal conductivity and preparation method therefor

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preparation example Construction

[0063] Preparation method of polyimide film

[0064] The invention provides a preparation method of a polyimide film.

[0065] The preparation method of the present invention comprises: a step of polymerizing polyimide acid; a step of mixing the polyimide acid and a thermally conductive filler to prepare a precursor composition; and imidizing the precursor composition to obtain Polyimide film steps.

[0066] In a specific example, the step of polymerizing polyimide acid includes: polymerizing the first dianhydride monomer and the first diamine monomer in a first organic solvent to prepare the first polyimide acid and polymerizing a second dianhydride monomer and a second diamine monomer in a second organic solvent to prepare a second polyimide acid, the polyimide acid may comprise the first polyimide Amino acid and a second polyimide acid.

[0067] The first organic solvent and the second organic solvent may be aprotic polar solvents respectively. As a non-limiting example...

preparation example a

[0102] Preparation example a: Preparation of the first polyimide acid

[0103] Add 407.5 g of N,N'-dimethylformamide (DMF) while injecting nitrogen into a 500 mL reactor with a stirrer and a nitrogen injection / discharge tube, and after setting the temperature of the reactor to 25° C., add 13.26 g of 4,4'-diaminodiphenyl ether (ODA) and 21.48g of 1,4-diaminobenzene (PPD), after confirming complete dissolution, gradually add 57.76g of pyromellitic dianhydride (PMDA), Thus, a first polyimide acid having a solid content of 18.5% by weight and a viscosity of 250,000 cP to 300,000 cP at 23° C. was prepared.

preparation example b

[0104] Preparation example b: Preparation of precursor composition

[0105] After setting the temperature of the reactor to 50° C., with respect to 100 parts by weight (100 g) of the first polyimide acid solid, a crude solution (9.73 g ) is mixed with the first polyimide acid, and stirred for 1 hour while maintaining the temperature to prepare a precursor composition.

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Abstract

The present invention provides a polyimide film comprising a polyimide resin and a thermally conductive filler, wherein the ratio of the average particle diameter of the thermally conductive filler to the thickness of the polyimide film (= average particle diameter/thickness) is 0.3 to 0.5.

Description

technical field [0001] The present invention relates to a polyimide film with improved thermal conductivity and its preparation method. Background technique [0002] Polyimide (PI) is a polymer material with the highest level of heat resistance, electrical insulation, and chemical resistance among organic materials based on a rigid aromatic backbone and an imide ring with excellent chemical stability. . [0003] On the other hand, with the high development trend of informatization, a large amount of information has been accumulated, and electrical / electronic equipment or components that process and convey this information at a high speed are being actively developed. Based on its own excellent physical properties, polyimide is regarded as It is widely used as these electrical insulating films and protective films. [0004] In recent years, in order to prevent performance degradation of electric / electronic equipment or parts due to heat generation of electronic equipment, p...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08G73/10C08K3/22C08K3/013
CPCC08L79/08C08K3/22C08G73/10C08J5/18C08K3/013C08G73/1067C08G73/1071C08K2201/005C08K2003/2227C08L2205/025C08L2312/00
Inventor 金纪勋李吉男崔祯烈
Owner PI ADVANCED MATERIALS CO LTD