Semiconductor temperature control device and automatic optical detection equipment using same

Abstract

The invention discloses a semiconductor temperature control device and automatic optical detection equipment using the same. The semiconductor temperature control device comprises a positioning part which extends along a first direction, and multiple cooling units. The multiple cooling units are sequentially arranged on the positioning part in the first direction, the positions, on the positioning part, of the cooling units are adjustable in the first direction, and each cooling unit comprises a heat conduction base, a mounting plate, a semiconductor chilling plate and a cooling assembly which are sequentially arranged in the second direction perpendicular to the first direction; the heat conduction bases are in contact with an element to be subjected to temperature control; the mounting plates are arranged on the heat conduction bases; each semiconductor chilling plate is provided with a first end and a second end which are opposite in the second direction, and the first end is connected with the corresponding mounting plate; and each cooling assembly is connected with the second end of the corresponding semiconductor chilling plate and used for cooling the corresponding semiconductor chilling plate. According to the semiconductor temperature control device, different temperature control application occasions can be met, and high-precision temperature control can be achieved.

Description

technical field [0001] The invention belongs to the technical field of optical detection, and relates to a semiconductor temperature control device and automatic optical detection equipment using the device. Background technique [0002] CIS (Contact Image Sensor, contact image sensor) testing equipment is a testing equipment that uses a CIS camera to collect PCB board images to check and analyze product quality. Because the CIS camera expands and shrinks greatly due to temperature changes, it affects the imaging quality. Specifically, due to the simple and compact structure of the CIS camera and the small installation space, the heat generated by the camera control part will be transferred to the surrounding environment when it is working. As a result, its working temperature changes. Since the CIS sensor components are sensitive to temperature changes, temperature changes will cause significant expansion and contraction of the sensor components, thereby affecting the over...

AI Technical Summary

Problems solved by technology

Because the CIS camera expands and shrinks greatly due to temperature changes, it affects the image quality

Specifically, due to the simple and compact structure of the CIS camera and the small installation space, the heat generated by the camera control part will be transferred to the surrounding environment when it is working. As a result, its working temperature changes. Since the CIS sensor components are sensitive to temperature changes, temperature changes will cause significant expansion and contraction of the sensor components, thereby affecting the overall measurement accuracy.

[0003] In related technologies, the air cooling and air cooling used for camera cooling cannot achieve precise control of camera temperature. Although water cooling can be controlled with high precision, its cooling range is small and cannot meet different temperature control applications.

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