Semiconductor temperature control device and automatic optical inspection equipment using the same

Abstract

The invention discloses a semiconductor temperature control device and automatic optical detection equipment using the same. The semiconductor temperature control device includes: a positioning part, the positioning part extends along a first direction; The position of the cooling unit on the positioning member along the first direction is adjustable, and the cooling unit includes a heat conduction base, a mounting plate, a semiconductor refrigeration sheet and a cooling unit arranged in sequence in a second direction perpendicular to the first direction. Assemblies, the thermal conduction base is used for contacting with the temperature-controlled element; the installation plate is arranged on the heat conduction base; the semiconductive refrigeration sheet has a first end and a second end opposite in the second direction, and the first end is connected with the installation plate; the cooling assembly It is connected with the second end of the semiconducting cooling sheet for cooling the semiconducting cooling sheet. According to the semiconductor temperature control device of the present invention, it can meet different temperature control application occasions, and can realize high-precision temperature control.

Description

technical field [0001] The invention belongs to the technical field of optical detection, and relates to a semiconductor temperature control device and automatic optical detection equipment using the same. Background technique [0002] CIS (Contact Image Sensor, contact image sensor) testing equipment is a testing equipment that uses a CIS camera to collect PCB board images to check and analyze product quality. Because the CIS camera expands and shrinks greatly due to temperature changes, it affects the imaging quality. Specifically, due to the simple and compact structure of the CIS camera and the small installation space, the heat generated by the camera control part will be transferred to the surrounding environment when it is working. As a result, its working temperature changes. Since the CIS sensor components are sensitive to temperature changes, temperature changes will cause significant expansion and contraction of the sensor components, thereby affecting the overal...

AI Technical Summary

Problems solved by technology

Because the CIS camera expands and shrinks greatly due to temperature changes, it affects the image quality

Specifically, due to the simple and compact structure of the CIS camera and the small installation space, the heat generated by the camera control part will be transferred to the surrounding environment when it is working. As a result, its working temperature changes. Since the CIS sensor components are sensitive to temperature changes, temperature changes will cause significant expansion and contraction of the sensor components, thereby affecting the overall measurement accuracy.

[0003] In related technologies, the air cooling and air cooling used for camera cooling cannot achieve precise control of camera temperature. Although water cooling can be controlled with high precision, its cooling range is small and cannot meet different temperature control applications.

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