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Semiconductor device package and method of manufacturing the same

一种半导体、设备的技术，应用在半导体设备封装和其制造领域，能够解决难以实现细间距、阻碍AiP系统小型化、有机衬底厚度厚等问题

Pending Publication Date: 2021-08-13
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the process limitation of the organic substrate, it is difficult to achieve fine pitch (less than 15 / 15 μm), and the thickness of the organic substrate is relatively thick, which will hinder the miniaturization of the AiP system

Method used

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  • Semiconductor device package and method of manufacturing the same
  • Semiconductor device package and method of manufacturing the same
  • Semiconductor device package and method of manufacturing the same

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Embodiment Construction

[0022] Figure 1A A cross-sectional view of a semiconductor device package 1A according to some embodiments of the present disclosure is illustrated. The semiconductor device package 1A comprises a carrier 10 , circuit layers 11 , 13 , 14 , 20 , interconnect structures 12 a , 12 b , electronic components 15 , electrical contacts 16 and encapsulation bodies 17 , 18 and 19 .

[0023] In some embodiments, carrier 10 may be or include a glass substrate. In some embodiments, carrier 10 may be or include a radiating element having one or more radiating components (eg, antennas, lighting elements, sensors, or the like) disposed thereon. Carrier 10 may include conductive pads, traces and interconnects (eg vias). In some embodiments, carrier 10 may comprise a transparent material. In some embodiments, carrier 10 may comprise an opaque material. Compared with an organic substrate, it is easier to control the thickness of the glass carrier, which can contribute to the miniaturization ...

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Abstract

A semiconductor device package includes an emitting device and a first building-up circuit. The emitting device defines a cavity in the emitting device. The first building-up circuit is disposed on the emitting device.

Description

technical field [0001] The present disclosure relates to a semiconductor device package and a method of manufacturing the same, and more particularly, to a semiconductor device package including an antenna and a method of manufacturing the same. Background technique [0002] Wireless communication devices, such as cell phones, typically include antennas for transmitting and receiving radio frequency (RF) signals. Similarly, a wireless communication device includes an antenna and a communication module each disposed on a different portion of a circuit board. In a similar approach, the antenna and the communication module are manufactured separately and electrically connected to each other after being placed on the circuit board. Therefore, the two components may incur separate manufacturing costs. Furthermore, it may be difficult to reduce the size of a wireless communication device to obtain a suitably compact product design. To reduce cost and package size, an antenna-in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L23/31H01L21/56H01L23/66H01Q1/22
CPCH01L23/49816H01L23/49827H01L23/49838H01L23/3121H01L21/561H01Q1/2283H01L23/66H01L2223/6677H01L24/10H01L2224/16235H01L2224/73267H01L2924/181H01L2224/13101H01L2224/81801H01L24/16H01L24/81H01L24/97H01L23/49811H01L23/5389H01L21/486H01L23/49822H01L2224/16225H01L2224/32225H01L24/19H01L24/20H01L2224/73253H01L2224/95H01L2924/00012H01L2924/014H01L2924/00014H01L2224/81
Inventor 谢孟伟
Owner ADVANCED SEMICON ENG INC