Earphone shell injection mould and injection molding process thereof
A technology for injection molds and shells, which is applied in the field of injection molds for earphone shells and its injection molding process, and can solve problems affecting the production efficiency of earphone shells, poor heat dissipation and cooling effects, etc.
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Embodiment 1
[0038]The upper mold 1 and the lower mold 2 are compatible with each other, the bottom of the upper mold 1 is fixedly connected with a positioning rod 6 extending to the inside of the lower mold 2, and the inside of the lower mold 2 is provided with a hole with the same outer diameter as the positioning rod 6. The movable groove is provided with a movable groove equal to the outer diameter of the positioning rod 6 by setting the inside of the lower mold 2, which is convenient for the upper mold 1 and the lower mold 2 to quickly close the mold, and the bottom of the high-temperature-resistant shell 7 is fixedly connected with a support leg 8 , the number of supporting legs 8 is four, and they are equidistantly distributed at the four corners of the bottom of the high-temperature-resistant casing 7, and the ends of the four supporting legs 8 away from the high-temperature-resistant casing 7 are fixedly connected with a base 9, which is convenient for molding The mold 2 is support...
Embodiment 2
[0040] The inner top wall of the top plate 11 is provided with a demoulding device 3 for demoulding the upper mold 1, the demoulding device 3 includes a telescopic mechanism 12 and a connecting plate 13, and a telescopic mechanism 12 is fixedly installed on the inner top wall of the top plate 11 , the output end of the telescopic mechanism 12 is fixedly connected with a connection plate 13, the connection plate 13 is fixedly connected with the top of the upper mold 1, and the upper mold 1 on the side of the connection plate 13 is driven downward by the direction of the mold 2 by starting the telescopic mechanism 12 Move so that the bottom surface of the upper mold 1 is in close contact with the top surface of the lower mold 2, so that a closed state is reached between the upper mold 1 and the lower mold 2, and the telescopic mechanism 12 is activated to drive the side of the connecting plate 13 The upper mold 1 moves toward the telescopic mechanism 12, so that the bottom surfac...
Embodiment 3
[0042] The heat dissipation device 4 includes a cooling groove 14 and a cooling fan 15. The high temperature resistant shell 7 is provided with a cooling groove 14 near the base 9, and the base 9 is fixedly equipped with a cooling fan 15 near the cooling groove 14. The number of the cooling fans 15 is Two, by setting and starting the heat dissipation fan 15, the heat dissipated from the heat dissipation groove 14 is quickly dispersed, which effectively accelerates the heat dissipation speed of the lower mold 2, achieves the advantage of good heat dissipation effect, and solves the problem of poor heat dissipation effect and cooling effect of the mold , has seriously affected the production efficiency of the earphone housing. The exterior of the booster pump 17 is fixedly connected with a fixed ring 22 positioned on the outer wall of the high temperature resistant casing 7. By setting the external fixed connection of the booster pump 17, the fixed ring 22 is fixed. Effectively e...
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