Mounting device and mounting method

Abstract

The present invention provides a mounting device and a mounting method that realize stable, fast, highly precise positioning through an increase in the lowest cost in regard to mounting in a face-up manner so that an electrode surface of a substrate and an electrode surface of a chip component face the same direction. Specifically, the present invention provides a mounting device and a mounting method, the mounting device comprising: a recognition mechanism that recognizes a chip recognition mark and a substrate recognition mark across a mounting head from above the mounting head, the recognition mechanism being capable of moving in the in-plane direction of the substrate; and a control unit connected to the recognition mechanism, the control unit having a function for calculating the amount of positional displacement between the chip component and the substrate from position information that pertains to the chip recognition mark and the substrate recognition mark and that is obtained from the recognition mechanism, and a function for driving the mounting head and / or a substrate stage to move in accordance with the amount of positional displacement to carry out positioning. A chip recognition imaging means that recognizes a chip recognition mark and a substrate recognition imaging means that recognizes the substrate recognition mark are provided mutually independently in the recognition mechanism, and are provided so that the focal positions thereof via a shared optical axis passage differ from each other.

Description

technical field [0001] The present invention relates to a mounting device and a mounting method for mounting chip components on a substrate. In particular, it relates to a mounting device and a mounting method for performing face-up mounting in which an electrode surface of a substrate and an electrode surface of a chip component face the same direction. Background technique [0002] As a mounting method for mounting chip components such as semiconductor chips on a substrate such as a wiring board, face down (face down) mounting in which the electrode surface of the chip component faces the electrode surface of the substrate and the electrode surface of the substrate is mounted is known. The surface that is mounted in the same direction as the electrode surface of the chip component is mounted face-up. [0003] In any mounting method, high-precision alignment for mounting chip components on predetermined positions on the substrate is required, and identification marks for a...

AI Technical Summary

Problems solved by technology

In the device described in Patent Document 2, in the alignment stage, there is a difference in height between the chip identification mark and the substrate identification mark, so the first chip identification mark AC1 and the first substrate identification mark AS1 (and the second chip identification mark AC2 and The optical path length of the substrate identification second mark AS2) is different. Due to the relationship between the depth of focus, it is difficult to obtain images of the chip identification mark and the substrate identification mark at the same time with high resolution. drive, there are problems such as reduced mounting accuracy and reduced productivity

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