High-current driving device for SiC MOSFET in pulse power application
A driving device and pulse power technology, applied in the pulse field, can solve the problems of lack of ultra-fast gate drive research and other issues
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Embodiment 1
[0046] see figure 1 and figure 2 , a high-current drive device for SiC MOSFETs in pulsed power applications, the circuit structure is shown below:
[0047] Upper arm inductance L dr_h Connect the high-side drain parasitic inductance L Hd.int .
[0048] The high-side drain parasitic inductance L Hd.int The drain of the switch tube Q1 is connected in series.
[0049] The gate of the switching transistor Q1 is suspended. The source of the switching tube Q1 is connected in series with the parasitic inductance L of the source of the upper bridge arm Hs.int one end.
[0050] Upper arm source parasitic inductance L Hs.int The other end of the series gate inductance L g .
[0051] Upper arm source parasitic inductance L Hs.int The other end of the lower bridge arm drain parasitic inductance L in series Ld.int Then connect the drain of the switching tube Q2.
[0052] The gate of the switching transistor Q2 is suspended. The source of the switching tube Q2 is connected in...
Embodiment 2
[0066] A circuit structure using a high current driver for SiC MOSFETs in pulsed power applications, the circuit structure is as follows:
[0067] High side drain parasitic inductance L Hd.int Send drive positive voltage to MOSFET module.
[0068] The half-bridge gate driver sends a driving positive voltage to the MOSFET module through the upper arm inductor Ldr_h.
[0069] The high-side drain parasitic inductance L Hd.int The drain of the switch tube Q1 is connected in series.
[0070] The gate of the switching transistor Q1 is suspended. The source of the switching tube Q1 is sequentially connected in series with the parasitic inductance L of the source of the upper bridge arm Hs.int , The parasitic inductance of the drain of the lower bridge arm L Ld.int Then connect the drain of the switching tube Q2.
[0071] The gate of the switching transistor Q2 is suspended. The source of the switching tube Q2 is connected in series with the parasitic inductance L of the source...
Embodiment 3
[0086] see figure 1 and figure 2 , a high-current drive device and test unit for SiC MOSFETs in pulsed power applications, including GaNHEMTGateDriver, MOSFET, and Load, where L Hd.int , L Hs.int , L Ld.int , L Ls.int are the drain and source parasitic inductance of the upper bridge arm and the drain and source parasitic inductance of the lower bridge arm of the GaN HEMT half-bridge module, respectively. while L dr_h , L dr_s and L· are the upper arm inductance, lower arm inductance and grid inductance introduced by the drive circuit design.
[0087] In the application of nanosecond pulse generator, in order to make the SiC MOSFET have a faster voltage front, the distance between the driver IC and the gate of the SiC MOSFET is often shortened as much as possible. Therefore, the circuit proposed by the present invention does not involve conventional drive devices such as additional drive resistors and turn-off resistors. The parasitic inductance is the main factor affe...
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