Printed circuit board and electronic device
A printed circuit board and electrical connection technology, which is applied to printed circuit parts, printed circuits, electrical components, etc., can solve problems that affect product performance, affect signal quality, and rigid layout
Pending Publication Date: 2021-09-07
ZHEJIANG UNIVIEW TECH
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- Application Information
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Problems solved by technology
The existence of stub lines will cause signal reflection, which will seriously affect the signal quality, thereby affecting product performance; and due to the limited link channels to choose from, the layout is rigid
Method used
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[0028] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be fully described below through specific implementation in combination with the drawings in the embodiments of the present invention. Apparently, the described embodiments are some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts, All fall within the protection scope of the present invention.
[0029] figure 1 It is a structural schematic diagram of a printed circuit board provided in the background technology, such as figure 1 As shown, the printed circuit board of the background technology includes a differential signal input line 10', a first differential signal output line 20' and a second differential signal output line 30', and the differential ...
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The embodiment of the invention discloses a printed circuit board and an electronic device. The printed circuit board comprises a first bonding pad module, a second bonding pad module, a positive differential signal line input line, at least two positive differential signal line output lines, a negative differential signal line input line and at least two negative differential signal line output lines, wherein the first bonding pad module comprises a first input bonding pad and at least two first output bonding pads; the forward differential signal line output lines are arranged on different layers; the number of the forward differential signal line output lines is equal to that of the first output bonding pads, the forward differential signal line output lines and the first output bonding pads are in one-to-one correspondence, and at least one forward differential signal line output line is electrically connected with the first output bonding pads through first via holes; the second bonding pad module comprises a second input bonding pad and at least two second output bonding pads; the negative differential signal line output lines are arranged on different layers; and the number of the negative differential signal line output lines is equal to that of the second output bonding pads, the negative differential signal line output lines and the second output bonding pads are in one-to-one correspondence, and at least one negative differential signal line output line is electrically connected with the second output bonding pads through second via holes.
Description
technical field [0001] Embodiments of the present invention relate to the technical field of semiconductors, and in particular to a printed circuit board and an electronic device. Background technique [0002] In a printed circuit board (PCB, Printed Circuit Board), when it is necessary to perform signal transmission between two circuit modules, the signal to be transmitted is usually subjected to differential processing to obtain a differential signal. The so-called differential signal means that the input terminal sends two equivalent , Inverted signal, the output terminal judges the logic state "0" or "1" by comparing the difference between the two voltages. The pair of traces that carry differential signals is called a differential trace. Differential routing has the advantages of strong anti-interference ability and effective suppression of electromagnetic interference. [0003] In practical applications, in order to meet the corresponding performance requirements, th...
Claims
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Login to View More IPC IPC(8): H05K1/02
CPCH05K1/0245
Inventor 梅玉金
Owner ZHEJIANG UNIVIEW TECH