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Flexible circuit board and manufacturing method thereof

A flexible circuit board and flexible substrate technology, which is applied in the field of circuits and can solve problems such as breakage of conductive traces on flexible circuit boards

Pending Publication Date: 2021-09-07
BEIJING BOE TECH DEV CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the need to bend the flexible circuit board during use, the conductive traces in the flexible circuit board are also at risk of breaking

Method used

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  • Flexible circuit board and manufacturing method thereof
  • Flexible circuit board and manufacturing method thereof
  • Flexible circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0042] As another embodiment of the present disclosure, the flexible circuit board includes at least one second wiring group, such as Figure 5 As shown, the second routing group includes a plurality of first routings 120 and at least one second connecting routing 320. In the same second routing group, the plurality of first routings 120 are sequentially extended along the same extension direction. set, and there is a space between adjacent ends of two adjacent first lines 120, the width direction of the space intersects with the extending direction of the first line 120, and the two adjacent first lines 120 pass through the first line The two connection traces 220 are electrically connected. In this embodiment, the second connecting wire 320 can be arranged on the part of the flexible circuit board that is often bent during use, so as to avoid the first wire 120 from being broken due to frequent bending.

[0043] In the present disclosure, the second connection traces 320 ma...

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Abstract

The invention provides a flexible circuit board. The flexible circuit board comprises a first flexible substrate and a second flexible substrate attached to the first flexible substrate. The first flexible substrate comprises a first flexible base body layer, at least one first wiring groove formed on the first flexible base body layer, and at least one first conductive wire. The first conductive wires are arranged in the corresponding first wiring grooves. On the cross sections of the first wiring grooves, the size of the openings of the first wiring grooves does not exceed the size of the middle parts of the first wiring grooves, and the size of the bottoms of the openings of the first wiring grooves does not exceed the size of the middle parts of the first wiring grooves. The outer surfaces of the first conductive wires are attached to the surfaces of the first wiring grooves. The invention further provides a manufacturing method of the flexible circuit board.

Description

technical field [0001] The present disclosure relates to circuit technology, and in particular, to a flexible circuit board and a method for manufacturing the flexible circuit board. Background technique [0002] With the popularity of wearable devices, the application of flexible circuit boards is becoming more and more extensive. Since the flexible circuit board needs to be bent during use, the conductive traces in the flexible circuit board also have the risk of breaking. Therefore, how to avoid the breakage of the conductive traces during the bending process of the flexible circuit board has become a technical problem to be solved urgently in this field. Contents of the invention [0003] The purpose of the present disclosure is to provide a flexible circuit board and a method for manufacturing the flexible circuit board. [0004] As one aspect of the present disclosure, a flexible circuit board is provided, the flexible circuit board includes a first flexible substr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/09H05K3/02
CPCH05K1/0296H05K1/09H05K3/02H05K2201/05
Inventor 梁魁王迎姿
Owner BEIJING BOE TECH DEV CO LTD