Electronic device attachable to skin and manufacturing method therefor

A technology for electronic devices and skins, which is applied in the manufacture/assembly of piezoelectric/electrostrictive devices, circuits, electrical components, etc., and can solve the problems of difficulty in miniaturization, difficult integration of circuit components, and complicated preparation process.

Pending Publication Date: 2021-09-14
AMOREPACIFIC CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the preparation process is complicated and it is difficult to realize miniaturization
[0009] Furthermore, in fabricating skin sensors based on such elastic polymers, it is difficult to integrate circuit components of skin sensors onto elastic polymers because elastic polymers are softer than the deformable and commonly used silicon substrates.

Method used

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  • Electronic device attachable to skin and manufacturing method therefor
  • Electronic device attachable to skin and manufacturing method therefor
  • Electronic device attachable to skin and manufacturing method therefor

Examples

Experimental program
Comparison scheme
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no. 1 example

[0119] Figure 4a to Figure 4b A conceptual diagram schematically showing the manufacturing process of the skin sensor according to the first embodiment of the present invention.

[0120] refer to Figure 4a and Figure 4b The method for preparing the skin sensor 1 according to the first embodiment of the present invention includes the following steps: forming a sacrificial layer 105 on the substrate 101 (step S401); forming the sensor circuit unit 10 on the sacrificial layer 105 (step S410); The sensor circuit unit 10 (that is, the active layer 115) and the flexible patch 30 are bonded (bonding) (step S430); and the sacrificial layer 105 is etched to prepare a skin sensor 1 (step S450 ), wherein, forming the sensor circuit unit 10 on the sacrificial layer 105 (step S410) includes the following steps: forming electrodes 111 and / or interconnectors 112 on the sacrificial layer 105 (step S411); and / or forming an insulating layer 113 on the interconnector (step S413); and formi...

no. 2 example

[0267] Figure 11a to Figure 11b A conceptual diagram schematically showing a manufacturing process of a skin sensor according to a second embodiment of the present invention.

[0268] Referring to FIGS. 4 and 11 , a method of fabricating a skin sensor according to a second embodiment of the present invention is substantially similar to that of the skin sensor according to the first embodiment in FIG. 4 , so differences will be mainly described.

[0269] As shown in FIG. 4 , the active layer 115 of the sensor circuit unit 10 is formed closest to the flexible patch 30 among the components of the sensor circuit unit 10 .

[0270] However, in another embodiment, the active layer 115 of the sensor circuit unit 10 may be formed furthest from the flexible patch 30 among the components of the sensor circuit unit 10 . That is, it is possible to prepare Figure 1b and Figure 1c The skin sensor in 1.

[0271] Similar to the first embodiment, the manufacturing method of the skin-att...

no. 3 example

[0276] Figure 12a to Figure 12h A conceptual diagram schematically showing a manufacturing process of a skin sensor according to a third embodiment of the present invention.

[0277] Referring to FIGS. 4 and 12 , a method of fabricating a skin sensor according to a third embodiment of the present invention is substantially similar to that of the skin sensor according to the first embodiment in FIG. 4 , so differences will be mainly described.

[0278] According to the manufacturing method of the skin sensor of the second embodiment, the skin sensor 1 having the same structure as that of the first embodiment can be manufactured. However, referring to FIG. 12 , in the method of manufacturing the skin sensor 1 according to the third embodiment of the present invention, the process of preparing the flexible patch 30 and the process of preparing the semiconductor structure including the sensor circuit unit 10 are undivided integrated preparation. process. That is, unlike the man...

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Abstract

Embodiments relate to an electronic device attachable to skin and manufacturing method therefor, the electronic device comprising: a semiconductor circuit unit comprising a circuit device including an electrode, an interconnect, and the like and a semiconductor device including an insulation layer, an activation layer, and the like; and a flexible patch configured to be attachable to skin, wherein the flexible patch includes a plurality of through-holes, and the insulation layer includes a plurality of through-holes corresponding to the plurality of through-holes of the flexible patch. In the case that the activation layer consists of a piezoelectric material, the electronic device can be utilized as a skin sensor capable of obtaining deformation and/or elasticity information of skin.

Description

technical field [0001] 【Related Application】 [0002] This application claims U.S. Patent Application No. 16 / 223,541 filed on December 18, 2018 and Korean Patent No. 10-2019-0079400 filed on July 2, 2019 priority of the application, the entire contents of which are incorporated in this application by reference. [0003] The present invention relates to an electronic device that can be attached to the skin, and more particularly, to an electronic device that includes a semiconductor circuit unit and a flexible patch that can be attached to the skin and a manufacturing method thereof, wherein the semiconductor circuit unit includes a semiconductor components (for example, including active layers) and circuit components (for example, including electrodes and / or interconnectors, etc.), the flexible patch is used as a substrate integrated with the semiconductor circuit unit. In particular, a flexible patch used as a circuit substrate has many through holes, so it has high air per...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B5/00A61B5/24
CPCA61B5/442A61B5/6833A61B2562/12H10N30/875H10N30/88H10N30/302H10N30/073H10N30/06A61B5/24A61B2562/125A61B5/0077A61B5/443A61B5/6832H10N30/04H10N30/072H10N30/853H10N30/10513
Inventor 韩志娟延韩武金银珠金志焕
Owner AMOREPACIFIC CORP
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