Unlock instant, AI-driven research and patent intelligence for your innovation.

Filter and manufacturing method thereof

A manufacturing method and filter technology, applied to electrical components, impedance networks, etc., can solve problems such as increased cost and increased manufacturing complexity, and achieve the effects of preventing moisture intrusion, increasing manufacturing complexity, and reducing manufacturing costs

Active Publication Date: 2021-09-17
SUZHOU HUNTERSUN ELECTRONICS CO LTD
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this undoubtedly increases the manufacturing complexity and further increases the cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Filter and manufacturing method thereof
  • Filter and manufacturing method thereof
  • Filter and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] In this specification, it will also be understood that when a component (or region, layer, section) is referred to as being “on”, “connected to” or “coupled to” other elements with respect to other elements, The one component may be directly provided on / connected to / directly coupled to the one component, or there may also be an intervening third component. In contrast, when an element (or region, layer, section, etc.) in this specification is referred to as being "directly on," "directly connected to" or "directly coupled to" other elements relative to other elements, , no intervening elements are placed between them.

[0016] The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which various embodiments are shown. However, this disclosure may be implemented in many different ways and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a filter, which comprises a substrate and one or more resonators, and is characterized in that the substrate is provided with a dam structure surrounding the one or more resonators, and the dam structure extends into the substrate. In addition, the invention also relates to a manufacturing method of the filter, which comprises the following steps of: providing a substrate, and forming one or more resonators on the substrate; and a dam structure is formed on the substrate, the dam structure is arranged around the one or more resonators, and the dam structure extends into the substrate.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductors, and in particular, the present disclosure relates to filters and manufacturing methods thereof. Background technique [0002] A film bulk acoustic resonator (Film Bulk Acoustic Resonator, FBAR) is manufactured using a silicon substrate by means of micro-electro-mechanical system (Micro-Electro-Mechanical System, MEMS) technology and thin-film technology. Thin film cavity resonator filters are usually provided with a single seal ring. The single seal is deposited directly on the substrate. The bottom layer of the single sealing ring will undergo hydrolysis reaction under certain conditions. When the film cavity acoustic resonance filter device works under severe working conditions, moisture can easily invade the device through the bottom layer, causing the device to fail. [0003] Therefore, thin-film cavity acoustic resonator filters usually use multi-layer sealing rings. This...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H03H9/02H03H9/10H03H9/17H03H9/56H03H9/58H03H3/02
CPCH03H9/02047H03H9/02062H03H9/1007H03H9/171H03H9/564H03H9/582H03H3/02H03H2003/023
Inventor 唐兆云杨清华赖志国
Owner SUZHOU HUNTERSUN ELECTRONICS CO LTD