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Resource package submission and test method and device, electronic equipment and storage medium

A resource package and version technology, applied in error detection/correction, electrical digital data processing, software testing/debugging, etc., can solve problems such as low efficiency and achieve the effect of improving development efficiency

Active Publication Date: 2021-09-24
QINGDAO HAIER TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, most of the existing testing methods use simple verbal communication or document email communication, which is inefficient

Method used

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  • Resource package submission and test method and device, electronic equipment and storage medium
  • Resource package submission and test method and device, electronic equipment and storage medium
  • Resource package submission and test method and device, electronic equipment and storage medium

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Embodiment Construction

[0037] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Obviously, the described embodiments are part of the embodiments of the present invention , but not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0038] With the rapid development of the software industry and the rapid iterative requirements of development needs and development cycles, simple verbal communication or document email communication is inefficient due to multiple developments and cannot quickly get responses from all parties involved in development and testing.

[0039] Aiming at the above problems, the present invention pr...

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Abstract

The invention provides a resource package submission and test method and device, electronic equipment and a storage medium. The method comprises the steps: in response to a request of a construction system front-end page, returning a story list and a construction list of a to-be-tested resource package to the construction system front-end page; after test and submission information input by a user and sent by the front-end page of the construction system is received, locking the test and submission information, and inquiring the construction information of the resource packet; and after determining that a test submission list can be generated based on the construction information, creating a blank test submission list, filling the test submission basic information and the story list information, and generating the test submission list. According to the method and device, the electronic equipment and the storage medium provided by the invention, the development efficiency can be greatly improved.

Description

technical field [0001] The present invention relates to the technical field of application development, in particular to a method, device, electronic equipment and storage medium for extracting and testing resource packages. Background technique [0002] With the maturity of agile development and the rapid iterative realization of product functions, in order to meet the needs of rapid development iterations, more and more APPs (Application, application programs) adopt a hybrid development model. The business logic is not complicated to display the business, and the development is converted to H5. , a hybrid development model that can quickly update business requirements and hot updates. [0003] However, most of the existing testing methods use simple verbal communication or document email communication, which is inefficient. Therefore, how to quickly test and release the H5 resource package has become an urgent technical problem to be solved. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): G06F11/36G06F8/71
CPCG06F11/3684G06F8/71
Inventor 华彩娟
Owner QINGDAO HAIER TECH