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High-flatness tray

A flatness and tray technology, applied in the field of tray manufacturing process, can solve problems such as flatness does not meet the requirements, affects the use of electronic components, and the flatness of the tray surface does not meet the requirements, etc.

Pending Publication Date: 2021-09-28
威銤(苏州)智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the production of trays is generally made by injection molding, and the surface flatness of the trays after injection molding often fails to meet the requirements. Electronic components are worn during transportation and placement, which affects the use of electronic components

Method used

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  • High-flatness tray

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0018] The invention provides a tray with high flatness. Its working principle is to release the stress when the tray is ejected from the mold by setting gaps around the tray body, so as to ensure the flatness of the tray surface and ensure the placement and transportation of electronic components. for security purposes.

[0019] The present invention will be described in further detail below in conjunction with examples and specific implementation methods.

[0020] Such as figure 1 As shown, a high-flatness pallet includes a pallet body 1 , a frame 2 arranged around the pallet body and several notches 3 arranged on the pallet.

[0021] in:

[0022] Two notches are provided on the upper and lower edges of the tray body, and one notch is provided on the left and right sides ...

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PUM

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Abstract

The invention discloses a high-flatness tray. The tray comprises a tray body and a plurality of notches formed in the tray, and the notches are distributed in the peripheral side walls of the tray body. The notches are formed in the periphery of the tray body, so that stress is released when the tray is subjected to injection molding and demolding, and the purposes of ensuring the flatness of the surface of the tray and ensuring the safety of placement and transportation of electronic components are achieved.

Description

technical field [0001] The invention relates to a pallet manufacturing process, in particular to a pallet with high flatness. Background technique [0002] As we all know, electronic chips are a type of small electronic components, which need to use trays during transportation and production. In the prior art, the production of trays is generally made by injection molding, and the surface flatness of the trays after injection molding often fails to meet the requirements. Electronic components are worn during transportation and placement, which affects the use of electronic components. [0003] The information disclosed in this background section is only intended to enhance the understanding of the general background of the present invention, and should not be considered as an acknowledgment or any form of suggestion that the information constitutes the prior art that is already known to those skilled in the art. Contents of the invention [0004] In order to solve the ab...

Claims

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Application Information

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IPC IPC(8): B65D19/38B65D19/22B29C45/00
CPCB65D19/38B65D19/0004B29C45/0025
Inventor 吴强唐甜甜陈国华
Owner 威銤(苏州)智能科技有限公司