Active heat dissipation structure attached to passive heat dissipation piece
A technology of heat dissipation structure and heat dissipation parts, which is applied to the components of pumping devices for elastic fluids, pump elements, non-variable pumps, etc., and can solve the problems that the conventional structure cannot be implemented in a fast and convenient way for users
Pending Publication Date: 2021-09-28
TAICHUANG TECH
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Problems solved by technology
[0004] The main purpose of the present invention is to solve the problem that the conventional structure cannot be implemented by the user in a fast and convenient manner
Method used
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[0052] Detailed description and technical contents of the present invention are as follows with regard to coordinating accompanying drawings now:
[0053] see figure 1 and figure 2 , the present invention provides an active heat dissipation structure 10, the active heat dissipation structure 10 can be attached to a passive heat dissipation element 20, for example, the passive heat dissipation element 20 can be a vertical radiator (not shown in the figure ), and the shape of the passive heat sink 20 is not limited to those shown in the drawings of the present invention.
[0054] Also, see Figure 2 to Figure 5 The active heat dissipation structure 10 includes a fan 11, an outer frame 12 and two mounting parts 14, 16, the outer frame 12 is assembled with the fan 11, the outer frame 12 includes two first assembly parts 121, 122, The two first connecting parts 121, 122 are respectively arranged on the outer edge of the outer frame 12 and are arranged in parallel and spaced apa...
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The invention discloses an active heat dissipation structure attached to a passive heat dissipation piece. The heat dissipation structure comprises a fan, an outer frame on which the fan is arranged, and two mounting pieces; the outer frame comprises two first assembling parts which are arranged on two opposite sides of the outer frame; the two mounting pieces are arranged on the passive heat dissipation piece and connected with the outer frame in an assembled mode, and each mounting piece is provided with a first mounting part connected with one of the two first assembling parts in an assembled mode. Furthermore, each first assembling part comprises a track provided with a plurality of positioning points and a guide groove parallel to the track. Each first mounting part comprises at least one elastic sheet which is stressed to move in the track and can be limited by one of the positioning points, and the guide block that can slide in the guide groove when being stressed. And the outer frame can change the position of the fan relative to the passive heat dissipation piece through the two first assembling parts and the two first mounting parts.
Description
technical field [0001] The invention relates to an active heat dissipation structure, in particular to an active heat dissipation structure which can be attached to a passive heat dissipation piece. Background technique [0002] Existing computer devices are equipped with a large number of electronic components in order to pursue powerful computing capabilities. However, if a large number of electronic components are installed in a certain space, it will be difficult for the components to dissipate heat. Although most of the current computer devices are equipped with vertical heat sinks to reduce the temperature of the components, the aforementioned methods are still difficult to meet the heat dissipation requirements of the components. Therefore, it is an important issue to install additional active cooling components such as fans in a limited space. [0003] In view of this, the existing patent US 10,444,807 discloses the technical content of additionally hanging the fan o...
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IPC IPC(8): G06F1/18G06F1/20F04D29/60
CPCG06F1/183G06F1/20F04D29/60G06F2200/202
Inventor 黄泰棋
Owner TAICHUANG TECH