Method for silk-screen printing of solder resist ink on circuit board

A technology of solder resist ink and circuit board, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve the problem of not being able to meet different requirements of ink thickness, and achieve the effect of meeting different requirements of ink thickness

Pending Publication Date: 2021-10-01
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, with this method of screen printing solder resist ink, the ink thickness at each position of the circuit board is basically the same, which cannot meet the different requirements for ink thickness at different positions on the circuit board

Method used

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  • Method for silk-screen printing of solder resist ink on circuit board
  • Method for silk-screen printing of solder resist ink on circuit board
  • Method for silk-screen printing of solder resist ink on circuit board

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0025] The terms "first", "second", and "third" in this application are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least t...

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Abstract

The invention provides a method for silk-screen printing of solder resist ink on a circuit board. The method comprises the following steps: silk-screening solder resist ink at a preset position of a first surface and / or a second surface of the circuit board, wherein the first surface and the second surface are oppositely arranged; pre-drying the circuit board so as to dry the solder resist ink until the solder resist ink is not adhered to an object; silk-screening solder resist ink on the whole first surface and the second surface of the circuit board; and pre-drying the circuit board to dry the solder resist ink until the solder resist ink is not adhered to an object. According to the method, the solder resist ink can be silk-screened on the circuit board, and different requirements of different positions on the circuit board on the thickness of the ink can be met.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for screen printing solder resist ink on a circuit board. Background technique [0002] After the circuits on the circuit board are completed, it is often necessary to screen-print solder resist ink on the surface, which not only protects the circuits on the circuit board, but also avoids short circuits between pads when electronic components are mounted. [0003] At present, the method of screen printing solder resist ink on a circuit board is generally to first screen print the solder resist ink on the first surface of the circuit board, and then perform pre-baking to make the ink solidify; Solder resist ink is screen-printed, and pre-baked again to cure the ink, followed by alignment exposure and development to form the required solder resist layer on the circuit board. [0004] However, with this method of screen-printing the solder resist ink, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/28H05K2203/1476
Inventor 缪桦周睿
Owner SHENNAN CIRCUITS
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