The invention particularly relates to sintered type electronic conductive gold paste and a preparation method thereof. The gold paste comprises the following components in parts by weight: 70-80% of gold powder, 5-10% of glass powder, 10-20% of an organic carrier and 0.5-3% of an assistant. The raw materials are stirred and mixed uniformly according to a proportion, and a mixture is grinded and filtered to obtain the sintered type electronic conductive gold paste. The cofiring matching between the sintered type electronic conductive gold paste and a ceramic substrate is good; after a film is formed by sintering, the square resistance of a film layer is less than or equal to 5 milliohm/square, and the film layer is high in compactness; the surface is flat and smooth; the stripping adhesiveforce is larger than or equal to 50N/(2*2)mm<2>; and the gold paste does not contain harmful elements such as lead, cadmium and the like, is environment-friendly, simple in preparation process and easy to industrialize, and can be widely applied to a thick-film hybrid integrated circuits (HIC), a large-scale integrated circuit (LSI), a ceramic encapsulated integrated circuit (IC), a thermistor, asemiconductor package, a multilayer wiring circuit, a hybrid integrated circuit and the like.