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42results about How to "Fine graphics" patented technology

Method for manufacturing microwave thin film attenuator

The invention belongs to the technical field of attenuators and relates to a method for manufacturing a microwave thin film attenuator. The method comprises the steps that a medium substrate is processed through a laser cutting method, and a through hole is formed in the position of a grounding electrode; metallization of the surface of the medium substrate and the inside of through hole is achieved through a vacuum sputtering method, and a metallized film layer structure is formed; a attenuator diagram is formed through the photolithography technique; a conductor circuit is thickened through electroplating; thermal oxidation resistance adjustment is conducted on the whole piece of attenuator through a heating method, a probe station is utilized to conduct index testing on the attenuator; independent attenuator diagrams are formed in a cutting method, and the lateral metallization effect is presented on the four corners of the attenuator. The method for manufacturing the microwave thin film attenuator can achieve the fine circuit diagrams, is favorable for being minimized, meets the requirements for the occasions of high frequency application, avoids single sheet manual edge wrapping and grounding, improves production efficiency, and is favorable for volume production.
Owner:THE 41ST INST OF CHINA ELECTRONICS TECH GRP

Sintered type electronic conductive gold paste and preparation method thereof

The invention particularly relates to sintered type electronic conductive gold paste and a preparation method thereof. The gold paste comprises the following components in parts by weight: 70-80% of gold powder, 5-10% of glass powder, 10-20% of an organic carrier and 0.5-3% of an assistant. The raw materials are stirred and mixed uniformly according to a proportion, and a mixture is grinded and filtered to obtain the sintered type electronic conductive gold paste. The cofiring matching between the sintered type electronic conductive gold paste and a ceramic substrate is good; after a film is formed by sintering, the square resistance of a film layer is less than or equal to 5 milliohm/square, and the film layer is high in compactness; the surface is flat and smooth; the stripping adhesiveforce is larger than or equal to 50N/(2*2)mm<2>; and the gold paste does not contain harmful elements such as lead, cadmium and the like, is environment-friendly, simple in preparation process and easy to industrialize, and can be widely applied to a thick-film hybrid integrated circuits (HIC), a large-scale integrated circuit (LSI), a ceramic encapsulated integrated circuit (IC), a thermistor, asemiconductor package, a multilayer wiring circuit, a hybrid integrated circuit and the like.
Owner:TAIYUAN HYPERION NEW MATERIAL CO LTD

Preparation method of carbon microelectrode array structure

The invention belongs to the technical field of carbon micro electro mechanical system, and provides a preparation method of a carbon microelectrode array structure. The method comprises steps of: (1) photolithography to obtain a carbon micro structure part of the array; (2) metal precipitation: precipitating one or more metal layers on the surface of the obtained carbon micro structure; and (3) pyrolysis: carrying out multiple steps of pyrolysis in an inert gas atmosphere or inert mixed gas atmosphere and at different temperatures. According to the above steps, carbon microelectrode array structure with nano structure integrated on the surface can be grew and obtained. The method of the invention combines thick photoresist lithography, metal precipitation and pyrolysis, so that the obtained micro-nano integrated structure has large specific surface area. The method of the present invention can be used in a micro electro mechanical system, and has the advantages of simple technology, low cost, high controllability, mass growth and good structure. The obtained micro-nano integrated structure has good electrical properties, and can be used as a motor and be widely applied to microcomputer fields, such as the minicell and micro electrochemical sensor, etc.
Owner:HUAZHONG UNIV OF SCI & TECH

Formation method of semiconductor device

The invention discloses a formation method of a semiconductor device. The formation method comprises steps of: providing a substrate, a grid membrane arranged on the surface of the substrate and an initial mask layer arranged on the surface of the grid membrane; forming a graphical photoresist layer on the initial mask layer; taking the graphical photoresist layer as a mask, and etching the initial mask layer to form multiple separated hard mask layers, wherein polymer impurities are formed on the hard mask layers and the surface of the gate membrane; using the ashing technology to remove the graphical photoresist layer, wherein the ashing technology comprises first ashing technology and second ashing technology which are carries out successively, the first ashing technology is suitable for removing of silicon ions in the polymer impurities and the second ashing technology is suitable for removing carbon ions in the polymer impurities; after the ashing technology is performed, carrying out wet-process cleaning processing on the hard mask layers and the grid membrane; taking the hard mask layers as masks and etching the grid membrane so as to form multiple separated grid electrodes on the substrate; and forming a source region and a drainage region in the substrate on two sides of the grid electrodes. In this way, the quality of the formed grid electrodes is improved.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

Method for detecting visual angle deviation direction of LCD full-visual-angle VA

PendingCN112612152ABad thickness deformationSolve the problem of inaccurate offset detectionNon-linear opticsGraphicsAutofocus
The invention relates to the technical field of LCD testing, and in particular, relates to a method for detecting the visual angle deviation direction of an LCD full-visual-angle VA. According to the method for detecting the visual angle deviation direction of the LCD full-visual-angle VA, a video magnifier suitable for the product is selected according to the characteristics of the full-visual-angle LCD. The focal length is automatically and finely adjusted through an automatic detection judgment program. When the definition is optimal, a standard pattern at a fixed position is collected; the automatic detection program can automatically detect the nesting deviation direction and the deviation value of an ITO circuit, combined up and down, of the LCD, display the detected deviation value and judge whether the visual angle deviation value of the full-visual-angle product meets the requirement or not. In addition, the program can also clearly detect the defects of LCD graphic font convex-concave badness, graphic font thickness deformation badness, short circuit, missing scratching badness and the like. The full-visual-angle LCD precision detection device is high in detection precision, effectively improves the detection efficiency, and is accurate and effective in detection.
Owner:株洲晶彩电子科技有限公司

Preparation method of carbon microelectrode array structure

The invention belongs to the technical field of carbon micro electro mechanical system, and provides a preparation method of a carbon microelectrode array structure. The method comprises steps of: (1) photolithography to obtain a carbon micro structure part of the array; (2) metal precipitation: precipitating one or more metal layers on the surface of the obtained carbon micro structure; and (3) pyrolysis: carrying out multiple steps of pyrolysis in an inert gas atmosphere or inert mixed gas atmosphere and at different temperatures. According to the above steps, carbon microelectrode array structure with nano structure integrated on the surface can be grew and obtained. The method of the invention combines thick photoresist lithography, metal precipitation and pyrolysis, so that the obtained micro-nano integrated structure has large specific surface area. The method of the present invention can be used in a micro electro mechanical system, and has the advantages of simple technology, low cost, high controllability, mass growth and good structure. The obtained micro-nano integrated structure has good electrical properties, and can be used as a motor and be widely applied to microcomputer fields, such as the minicell and micro electrochemical sensor, etc.
Owner:HUAZHONG UNIV OF SCI & TECH

Electrophoresis coating method and whole set apparatus for pattern transfer of positive electrophoresis coating on printing board

InactiveCN101144967ASolve the problem of finer linesMeet the requirements of more miniaturizationElectrophoretic coatingsPhotosensitive composition applicationElectrophoresisMiniaturization
The present invention relates to a positive electrophoresis coating method and a complete set of equipment when a positive electrophoresis coating is used in image transferring of printed boards; the present invention adopts anode and cathode electrophoresis processes, and comprises the concrete steps as follow: (1) an anode or a cathode system can be achieved by connecting a printed board and a conductive device; the conductive device is connected with the anode or cathode of the electrophoresis power; the anode or cathode of the conductive device is connected with the anode or cathode of power to achieve a anode or a cathode system; (2) the printed board is positioned in the electrophoretic tank filled with electrophoretic painting solution to be conducted electrophoresis; (3) having treated by posing, developing and etching, the positive electrophoretic coating film of the electrophoresis can be made out an image of the printed board. The present invention solves the problem further refining the lines in image transferring of the printed circuit board, as well as making the image of the printed circuit board more sophisticated, more accurate, more compact, and thereby electronic products can meet the miniaturized requirement.
Owner:武汉科利尔立胜工业研究院有限公司

Production method of pattern color mixing film

The invention relates to a production method of a pattern color mixing film. The production method comprises the following preparation steps: step 1, preparing a conductive solution; step 2, coating atransparent film with the conductive solution by using a reverse plate coating roller, wherein the resistance of the coated surface conductor reaches 40-70 [ohm]/square; 3, respectively fixing the positive electrode pattern conducting layer film and the negative electrode pattern conducting layer film on two sides of a liquid crystal coating machine, wherein the positive electrode conducting region and the negative electrode conducting region are oppositely arranged; coating PDLC liquid crystals between the positive electrode pattern conducting layer thin film and the negative electrode pattern conducting layer thin film; and drying and rolling to obtain the pattern color mixing film. The pattern color mixing film prepared by the invention is simple in structure and easy to manufacture; and different reverse coating rollers can be manufactured according to the requirements of customers to obtain pattern toning films with different patterns, and the pattern contour lines are manufactured by printing, so that the patterns are exquisite and fine, and the display effect is good.
Owner:JIANGYIN TONGLI OPTOELECTRONICS TECH

Electrophoresis coating method and whole set apparatus for pattern transfer of positive electrophoresis coating on printing board

InactiveCN101144967BSolve the problem of finer linesMeet the requirements of more miniaturizationElectrophoretic coatingsPhotosensitive composition applicationElectrophoresisMiniaturization
The present invention relates to a positive electrophoresis coating method and a complete set of equipment when a positive electrophoresis coating is used in image transferring of printed boards; the present invention adopts anode and cathode electrophoresis processes, and comprises the concrete steps as follow: (1) an anode or a cathode system can be achieved by connecting a printed board and a conductive device; the conductive device is connected with the anode or cathode of the electrophoresis power; the anode or cathode of the conductive device is connected with the anode or cathode of power to achieve a anode or a cathode system; (2) the printed board is positioned in the electrophoretic tank filled with electrophoretic painting solution to be conducted electrophoresis; (3) having treated by posing, developing and etching, the positive electrophoretic coating film of the electrophoresis can be made out an image of the printed board. The present invention solves the problem further refining the lines in image transferring of the printed circuit board, as well as making the image of the printed circuit board more sophisticated, more accurate, more compact, and thereby electronic products can meet the miniaturized requirement.
Owner:武汉科利尔立胜工业研究院有限公司

Method for forming semiconductor device

The invention discloses a formation method of a semiconductor device. The formation method comprises steps of: providing a substrate, a grid membrane arranged on the surface of the substrate and an initial mask layer arranged on the surface of the grid membrane; forming a graphical photoresist layer on the initial mask layer; taking the graphical photoresist layer as a mask, and etching the initial mask layer to form multiple separated hard mask layers, wherein polymer impurities are formed on the hard mask layers and the surface of the gate membrane; using the ashing technology to remove the graphical photoresist layer, wherein the ashing technology comprises first ashing technology and second ashing technology which are carries out successively, the first ashing technology is suitable for removing of silicon ions in the polymer impurities and the second ashing technology is suitable for removing carbon ions in the polymer impurities; after the ashing technology is performed, carrying out wet-process cleaning processing on the hard mask layers and the grid membrane; taking the hard mask layers as masks and etching the grid membrane so as to form multiple separated grid electrodes on the substrate; and forming a source region and a drainage region in the substrate on two sides of the grid electrodes. In this way, the quality of the formed grid electrodes is improved.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1
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