Sintered type electronic conductive gold paste and preparation method thereof

A technology of electronic conduction and gold paste, which is used in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. It can solve the problems of affecting the electrical properties of conductive gold paste, uneven sintered film, and high sintering activity. , to achieve the effect of low sintering activity, smooth surface and high film density
CN110322983AInactive Publication Date: 2019-10-11TAIYUAN HYPERION NEW MATERIAL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
TAIYUAN HYPERION NEW MATERIAL CO LTD
Publication Date
2019-10-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention particularly relates to sintered type electronic conductive gold paste and a preparation method thereof. The gold paste comprises the following components in parts by weight: 70-80% of gold powder, 5-10% of glass powder, 10-20% of an organic carrier and 0.5-3% of an assistant. The raw materials are stirred and mixed uniformly according to a proportion, and a mixture is grinded and filtered to obtain the sintered type electronic conductive gold paste. The cofiring matching between the sintered type electronic conductive gold paste and a ceramic substrate is good; after a film is formed by sintering, the square resistance of a film layer is less than or equal to 5 milliohm / square, and the film layer is high in compactness; the surface is flat and smooth; the stripping adhesiveforce is larger than or equal to 50N / (2*2)mm<2>; and the gold paste does not contain harmful elements such as lead, cadmium and the like, is environment-friendly, simple in preparation process and easy to industrialize, and can be widely applied to a thick-film hybrid integrated circuits (HIC), a large-scale integrated circuit (LSI), a ceramic encapsulated integrated circuit (IC), a thermistor, asemiconductor package, a multilayer wiring circuit, a hybrid integrated circuit and the like.
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Description

technical field

[0001] The invention relates to a conductive gold paste and a preparation method thereof, in particular to a sintered electronic conductive gold paste and a preparation method thereof. Background technique

[0002] Conductive pastes can generally be divided into two categories, namely polymer conductive pastes and sintered conductive pastes. The polymer conductive paste is dried or cured to form a film, and the organic polymer is used as the bonding phase. The sintering temperature of the sintering type conductive paste is usually higher than 500°C, and glass powder or oxide is used as the bonding phase. Sintered gold paste is widely used in the manufacture of electronic components such as capacitors and potentiometers as well as electrical components such as high-voltage and high-frequency porcelain parts because of its excellent conductivity, solderability, hot-press weldability and corrosion resistance. The functional and structural materials integrating...

Claims

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