Sintered type electronic conductive gold paste and preparation method thereof

A technology of electronic conduction and gold paste, which is used in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. It can solve the problems of affecting the electrical properties of conductive gold paste, uneven sintered film, and high sintering activity. , to achieve the effect of low sintering activity, smooth surface and high film density

Inactive Publication Date: 2019-10-11
TAIYUAN HYPERION NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the rapid development of the electronics industry, the quality requirements for electronic components are getting higher and higher. The current conductive gold paste has poor printability and high sintering activity, which is easy to cause the film layer to burst and cause the sintered fil

Method used

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  • Sintered type electronic conductive gold paste and preparation method thereof
  • Sintered type electronic conductive gold paste and preparation method thereof
  • Sintered type electronic conductive gold paste and preparation method thereof

Examples

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preparation example Construction

[0047] Preferably, the preparation method of described gold powder, comprises the steps:

[0048](1) Add a dispersant to the chloroauric acid solution, and fully stir and dissolve it in a water bath at 80° C. to form gold solution A, wherein the quality of the dispersant is 1-5% of the chloroauric acid quality;

[0049] (2) Adding a dispersing agent to the reducing agent solution, fully stirring and dissolving it in a water bath at 80° C. to form a reducing solution B, wherein the quality of the dispersing agent is 5-10% of the mass of the chloroauric acid;

[0050] (3) At 70-80°C, add the reducing solution B into the gold solution A under stirring, and control the pH of the system to 3-4 through the pH adjusting solution until the reaction is complete; set aside at room temperature, wash, and dry to obtain gold dust.

[0051] Preferably, the dispersant in step (1) is any one or more of sodium polyacrylate, oleic acid, and gum arabic.

[0052] Preferably, the chloroauric aci...

Embodiment 1

[0073] A sintered conductive gold paste comprises the following components by weight percentage: 70% of gold powder, 5% of glass powder, 10% of organic vehicle and 0.5% of additives. The preparation method of the above-mentioned sintered conductive gold paste comprises the following steps: according to the above ratio, adding glass powder into the organic carrier and stirring and mixing evenly, then adding additives and continuing to stir and mix evenly, then adding gold powder and continuing to stir and mix evenly, finally in three Grind on a roller machine until the slurry has a fineness of 4um and a viscosity of 50kcps, and passes through a 300-mesh filter to obtain a sintered conductive gold paste.

[0074] Further, the gold powder has a purity of 99.95%, an average particle diameter of 0.3 μm, a specific surface area of ​​1.85 m2 / g, and a tap density of 6.59 g / cm3. The preparation method of above-mentioned gold powder, comprises the steps: chloroauric acid is dissolved in...

Embodiment 2

[0080] A sintered conductive gold paste comprises the following components by weight percentage: 80% of gold powder, 10% of glass powder, 20% of organic vehicle and 3% of additives. The preparation method of the above-mentioned sintered conductive gold paste comprises the following steps: according to the above ratio, adding glass powder into the organic carrier and stirring and mixing evenly, then adding additives and continuing to stir and mix evenly, then adding gold powder and continuing to stir and mix evenly, finally in three Grind on a roller machine until the slurry has a fineness of 5um and a viscosity of 200kcps, and passes through a 500-mesh filter to obtain a sintered conductive gold paste.

[0081] The gold powder has a purity of 99.97%, an average particle size of 0.6 μm, and a specific surface area of ​​0.85 m 2 / g, tap density 7.12g / cm 3 . The preparation method of above-mentioned gold powder, comprises the steps: chloroauric acid is dissolved in deionized wa...

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Abstract

The invention particularly relates to sintered type electronic conductive gold paste and a preparation method thereof. The gold paste comprises the following components in parts by weight: 70-80% of gold powder, 5-10% of glass powder, 10-20% of an organic carrier and 0.5-3% of an assistant. The raw materials are stirred and mixed uniformly according to a proportion, and a mixture is grinded and filtered to obtain the sintered type electronic conductive gold paste. The cofiring matching between the sintered type electronic conductive gold paste and a ceramic substrate is good; after a film is formed by sintering, the square resistance of a film layer is less than or equal to 5 milliohm/square, and the film layer is high in compactness; the surface is flat and smooth; the stripping adhesiveforce is larger than or equal to 50N/(2*2)mm<2>; and the gold paste does not contain harmful elements such as lead, cadmium and the like, is environment-friendly, simple in preparation process and easy to industrialize, and can be widely applied to a thick-film hybrid integrated circuits (HIC), a large-scale integrated circuit (LSI), a ceramic encapsulated integrated circuit (IC), a thermistor, asemiconductor package, a multilayer wiring circuit, a hybrid integrated circuit and the like.

Description

technical field [0001] The invention relates to a conductive gold paste and a preparation method thereof, in particular to a sintered electronic conductive gold paste and a preparation method thereof. Background technique [0002] Conductive pastes can generally be divided into two categories, namely polymer conductive pastes and sintered conductive pastes. The polymer conductive paste is dried or cured to form a film, and the organic polymer is used as the bonding phase. The sintering temperature of the sintering type conductive paste is usually higher than 500°C, and glass powder or oxide is used as the bonding phase. Sintered gold paste is widely used in the manufacture of electronic components such as capacitors and potentiometers as well as electrical components such as high-voltage and high-frequency porcelain parts because of its excellent conductivity, solderability, hot-press weldability and corrosion resistance. The functional and structural materials integrating...

Claims

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Application Information

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IPC IPC(8): H01B1/16H01B1/22H01B13/00
CPCH01B1/16H01B1/22H01B13/00
Inventor 孙晓光赵刚郎嘉良黄翟
Owner TAIYUAN HYPERION NEW MATERIAL CO LTD
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