Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Transition pore-filling slurry for connecting upper and lower gold and silver layers of film belt in LTCC (Low Temperature Co-Fired Ceramic) substrate

A technology for connecting films and substrates, applied in the field of transition filling paste, can solve problems such as migration, and achieve the effects of good electrical conductivity, good electrical conductivity and good chemical stability

Active Publication Date: 2021-12-28
西安宏星电子浆料科技股份有限公司
View PDF9 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of silver ion migration in the transitional hole-filling slurry, the present invention provides a transitional hole-filling slurry using titanium nitride (TiN) powder, which can be prepared between LTCC substrates Dense metal layer, good durability and good electrical conductivity transition hole filling layer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Transition pore-filling slurry for connecting upper and lower gold and silver layers of film belt in LTCC (Low Temperature Co-Fired Ceramic) substrate
  • Transition pore-filling slurry for connecting upper and lower gold and silver layers of film belt in LTCC (Low Temperature Co-Fired Ceramic) substrate
  • Transition pore-filling slurry for connecting upper and lower gold and silver layers of film belt in LTCC (Low Temperature Co-Fired Ceramic) substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Weigh 8g of gold powder, 70g of silver powder, 2g of platinum powder, 5g of Ca-B-Si glass powder, 10g of TiN powder, and 5g of organic carrier, stir evenly with a glass rod, and place it for more than 1 hour to complete infiltration, and then roll on a three-roller machine , so that the fineness ≦ 15μm, to obtain transitional hole filling slurry.

Embodiment 2

[0026] Weigh 12.5g of gold powder, 63.5g of silver powder, 7g of platinum powder, 3g of Ca-B-Si glass powder, 9g of TiN powder, and 5g of organic carrier, stir evenly with a glass rod, and place it for more than 1 hour to complete infiltration, and then put it on a three-roll machine Rolling to make the fineness≦15μm, to obtain transitional hole filling slurry.

Embodiment 3

[0028] Weigh 12.5g of gold powder, 63.5g of silver powder, 7g of platinum powder, 3g of Ca-B-Si glass powder, 4g of TiN powder, and 10g of organic carrier, stir evenly with a glass rod, and place it for more than 1 hour to complete infiltration, and then put it on a three-roller machine Rolling to make the fineness≦15μm, to obtain transitional hole filling slurry.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
sizeaaaaaaaaaa
sizeaaaaaaaaaa
Login to View More

Abstract

The invention discloses a transition pore-filling slurry for connecting upper and lower gold and silver layers of a film be in an LTCC substrate. The transition pore-filling slurry is prepared from the following components in percentage by mass: 8-13% of gold powder, 60-70% of silver powder, 2-7% of platinum powder, 3-8% of Ca-B-Si glass powder, 2-10% of TiN powder and 5-15% of an organic carrier. The pore-filling transition slurry has the advantages of high cofiring matching performance with an A6 film belt, high bonding performance with an upper gold and silver layer and a lower gold and silver layer, high pore-filling compactness, high conductivity and the like.

Description

technical field [0001] The invention belongs to the technical field of conductive paste, and in particular relates to a transition hole-filling paste applied to a connection film of a low-temperature co-fired ceramic (LTCC) substrate with upper and lower gold and silver film layers. Background technique [0002] With the wide application of electronic products, light, small and thin become the mainstream development trend, and the requirements for the performance of integrated circuits are getting higher and higher. Compared with traditional integrated circuits, integrated circuits made by LTCC technology have greatly improved integration and can Further reducing the size of electronic components while maintaining their original functions has broad application prospects. The connection and conduction of the circuit between the LTCC substrates plays a decisive role in the stable operation of the entire circuit. Therefore, the development of new products that match the LTCC s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/14H01B1/16H01B1/20H01B1/22H01L23/498
CPCH01B1/14H01B1/16H01B1/20H01B1/22H01L23/49883
Inventor 张建益王明奎杜彬张琳党丽萍张啸
Owner 西安宏星电子浆料科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com