29results about How to "Good bonding" patented technology

The invention provides a dual-pressure-point terahertz chip, a dual-pressure-point terahertz assembly and a preparation method. The double-pressure-point structure of the double-pressure-point terahertz chip comprises a substrate, a signal bonding pad and two ground bonding pads symmetrically arranged on the two sides of the signal bonding pad. The signal bonding pad comprises a first signal bonding pad and a second signal bonding pad, the first signal bonding pad is close to the edge of the dual-pressure-point terahertz chip, and the second signal bonding pad is close to the interior of the dual-pressure-point terahertz chip; the width of the second signal bonding pad is smaller than that of the first signal bonding pad; the two ground bonding pads are special-shaped bonding pads, each of the two ground bonding pads comprises a first part and a second part which are connected with each other, the first part is close to the edge of the dual-pressure-point terahertz chip, one end of the second part is connected with the first part, and the other end of the second part is gradually close to the second signal bonding pad; the minimum distance between the second portions of the two ground bonding pads and the transverse central axis of the second signal bonding pad is smaller than the probe distance, and the maximum distance is larger than the probe distance. According to the invention, the parasitic inductance of the terahertz chip can be reduced.

According to the composite protective coating for the bolt surface, the preparation method and the application, the composite coating takes a bolt of a common model of an iron tower as a substrate, and a cathode arc ion plating technology and a magnetron sputtering technology are combined; the preparation method comprises the four main steps of substrate surface pretreatment, metal bonding layer preparation, metal nitride bearing layer preparation and surface molybdenum disulfide solid self-lubricating layer preparation. According to the method, reliable preparation of the composite coating on the complex thread surface of the bolt is achieved, the anti-loosening capacity of the bolt is remarkably improved through the low friction coefficient, good bearing capacity and excellent wear resistance, and meanwhile the composite coating further has good corrosion resistance and has wide application prospects in iron towers for communication, electric power and the like.

A copper-ceramic bonded body (10, 110) in which a copper member (12, 13, 112, 113) comprising copper or a copper alloy is bonded to a ceramic member (11, 111), in which an active metal compound layer (31) or a magnesium oxide layer (131) is formed in a region on the copper member side of the ceramic member (11, 111). The active metal compound layer (31) contains a compound of one or more active metals selected from the group consisting of Ti, Zr, Nb and Hf, and transition metal layers (34, 134) containing one or more transition metals selected from the group consisting of V, Cr, Mn, Fe, Co, Ni, Mo, Ta and W are formed at the interface of the active metal compound layer (31) or the magnesium oxide layer (131) on the copper member side.

The invention belongs to the field of hybrid bonding, and particularly discloses a bonding head for hybrid bonding and a bonding method.The bonding head comprises a bonding head body, the lower surface of the bonding head body is of a horizontal structure, and an annular air pressure groove with a downward opening is formed in the lower surface of the bonding head body along the edge; the positive-negative air pressure device is used for adjusting the air pressure in the annular air pressure groove; and the moving rod assembly comprises a main moving rod and a plurality of auxiliary moving rods, the main moving rod and the auxiliary moving rods penetrate through the bonding head body, and the auxiliary moving rods are arranged around the peripheral side of the main moving rod. According to the bonding head, the annular air pressure groove is formed in the bonding head body, the adsorption force on the to-be-bonded chip is increased, in the bonding process, the main moving rod and the auxiliary moving rod can push the to-be-bonded chip to enable the to-be-bonded chip to have enough deformation quantity, the chip cannot be separated from the bonding head body, the bonding effect of hybrid bonding is improved, and the bonding efficiency is improved. And voids on the bonding interface are avoided.

The invention discloses an MEMS device functional layer preparation method and an MEMS device, and the method comprises the steps: providing a first substrate which is provided with a front surface and a back surface which are opposite to each other; etching the front surface of the first substrate, and forming a cavity in the front surface of the first substrate; providing a second substrate having opposite front and back surfaces; forming an etching stop layer on the front surface of the second substrate; bonding the front surface of the second substrate with the front surface of the first substrate to enable the etching stop layer to seal the cavity; thinning the back surface of the second substrate; carrying out deep groove etching on the back surface of the second substrate, and stopping on the etching stop layer so as to form a movable functional layer pattern above the cavity; and removing the etching stop layer between the movable functional layer pattern and the cavity. According to the invention, the integrity of the functional layer pattern on the cavity structure of the MEMS device can be improved.

The invention belongs to the field of chemical technology innovation, and relates to a preparation method for producing an anhydrous formaldehyde catalyst. The catalyst is composed of transition metal and non-metal nitrogen-carbon doped molecular sieves, acidic sites and charge distribution of the molecular sieves are regulated and controlled through nitrogen-carbon doping, meanwhile, metal agglomeration in the reaction process is slowed down through formed metal-N-C bonds, the stability of the catalyst is improved, and the service life of the catalyst is prolonged. The catalyst shows excellent methanol anaerobic dehydrogenation catalytic activity within the temperature range of 400-700 DEG C, the methanol conversion rate reaches 90-99%, meanwhile, the formaldehyde yield reaches 57-67%, and the catalytic performance is kept stable within 70 h.

The invention discloses a silicon-carbon negative electrode material with high mechanical strength, and relates to the technical field of silicon-carbon negative electrode materials, and the silicon-carbon negative electrode material is prepared by the following steps: step 1, dispersing nano silicon, a carbon source, LiBF4 and lithium carbonate in a solvent, and uniformly stirring to prepare a suspension; then treating the suspension in an extrusion granulation mode to obtain a pressurized and granulated sample, and calcining the pressurized and granulated sample twice in an inert atmosphere to prepare a silicon-carbon negative electrode precursor material; performing carbon coating treatment on the carbon negative electrode precursor material through a chemical vapor deposition method to obtain a carbon-coated negative electrode material; and compounding the carbon-coated negative electrode material with PVDF (Polyvinylidene Fluoride) according to a mass ratio of 9.9: 0.1, and carrying out heat treatment at 750 DEG C to obtain the required silicon-carbon negative electrode material. Therefore, by adopting the silicon-carbon negative electrode material with the high mechanical strength, the technical problem that a porous silicon-carbon negative electrode material in the prior art is relatively low in apparent density and compaction density is solved.

The present invention belongs to the technical field of polymer materials and chromatographic separation, and discloses a polysaccharide derivative bonded solvent-resistant chromatographic column and its preparation method and application. The preparation method is: after the polysaccharide derivative is subjected to an alkalization reaction, an allyl epoxy-terminated polyether is added to carry out an etherification reaction to obtain an allyl polyether-substituted polysaccharide derivative; after the silica microspheres are subjected to an activation treatment, a triethoxysilane modification reaction is used to obtain a silicosilane sphere; the allyl polyether-substituted polysaccharide derivative is subjected to a silicohydrogenation bonding reaction with the silicosilane sphere to obtain a polysaccharide derivative-bonded silicon sphere; and finally, the chromatographic column is filled with the chromatographic column to obtain a polysaccharide derivative-bonded solvent-resistant chromatographic column. The preparation method of the present invention has the advantages of high bonding efficiency and simple preparation process. The obtained chromatographic column has the advantages of good solvent resistance and good separation effect.

The invention discloses wafer excessive glue trimming equipment and a wafer excessive glue trimming method. The wafer excessive glue trimming equipment comprises a rotary adsorption device, a cutter device, a moving device and a positioning device, the rotary adsorption device comprises a wafer carrying table used for adsorbing and driving a wafer to rotate; the cutter device is installed on the moving device, the moving device is located on the periphery of the rotary adsorption device, and the moving device is used for driving the cutter device to be close to or away from the periphery of the wafer on the wafer carrying table; the cutter device comprises a rotating assembly and a floating cutter head assembly; the positioning device comprises a visual positioning assembly arranged on the periphery of the rotary adsorption device, and the visual positioning assembly comprises a detection window for upward visual detection. Therefore, the trimming equipment disclosed by the invention has high flexibility, the distance between the cutter and the wafer can be followed in real time, the wafer is not damaged by the trimming cutter head, the excessive glue trimming is uniform, and the automatic glue removal of the notch can be realized. Compared with manual trimming, damage and pollution to the wafer caused by uneven stress of manual trimming are avoided, and the production efficiency and the product yield are effectively improved.

The application provides a cage type toughening agent and a preparation method thereof and a high-temperature-resistant low-loss adhesive film and a preparation method thereof, and belongs to the technical field of resin composite materials.The application uses active end group polyimide and POSS as monomers for preparing the cage type toughening agent, uses a catalyst to promote the reaction of the monomers, uses an organic solvent to dissolve the monomers and form liquid drops containing the monomers, uses a dispersing agent to disperse the liquid drops, and obtains the cage type toughening agent through suspension polymerization in the case that deionized water is used as a continuous phase.The cage type toughening agent provided by the application uses POSS as an inner core and uses a high-temperature-resistant thermoplastic polyimide resin with active end groups as an outer shell, the POSS provides high-temperature resistance, flame resistance and low moisture absorption, the polyimide layer provides primary toughening, the POSS provides secondary toughening, and the cage type toughening agent has the effect of double toughening; and the cage type toughening agent has good solubility and interfacial combination, can be matched with nitrile group resin, and can be used as a toughening agent for nitrile group resin.

The invention relates to the technical field of metal material processing, and discloses a copper-based composite material containing aluminum carbon nanotubes and a preparation method thereof, wherein the raw materials are CNTs, Al powder and Cu powder, and the composite material is composed of copper powder with a metal purity of 99.9%, aluminum powder with a purity of 99.9% preserved by wet method and carbon nanotubes, wherein the carbon nanotubes are attached to the aluminum powder, and copper is added to make them grow on the carbon nanotubes, so as to prepare a copper-based composite material containing aluminum carbon nanotubes, and Al powder is introduced and fully mixed for connection, and CNTs are uniformly dispersed on Al, thereby improving the electrical conductivity of the material. The metallurgical bonding surface of Al-C (CNTs) is well bonded, and Cu powder is added to the Al-C (CNTs) mixed powder, thereby overcoming the problem of poor interface bonding between aluminum and copper matrix, and by fully introducing and mixing CNTs, uniform dispersion of Al and Cu is ensured, thereby effectively improving the high temperature stability of the material.

The invention relates to a thermoplastic elastomer molded body, a composite molded body and a manufacturing method. Provided is a thermoplastic elastomer molded body which is capable of effectively suppressing peeling sound from glass and which has excellent adhesiveness to other members. A molded body containing: at least one component selected from the group consisting of (A) an ethylene-based copolymer and (B) a copolymer having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a conjugated diene compound; (C) a propylene-based polymer; and (D) a lubricant, in which the flexural modulus at room temperature of the molded body as measured in accordance with JIS K7171 is 20-300 MPa (inclusive), and the shear strength of the molded body with glass as measured under specific conditions is 40 N / cm2 or less.

The invention discloses a packaging structure and a packaging method, and the packaging structure comprises a substrate which comprises a bonding surface; the interconnection chip is bonded on the bonding surface of the substrate and is electrically connected with the substrate; the device chip comprises a first surface and a second surface which are opposite to each other, the first surface and the second surface are electrically connected with each other, and the first surface is bonded on the interconnection chip and is electrically connected with the interconnection chip; and the substrate layer is bonded on the second surface of the device chip. According to the invention, the first surface and the second surface, which are opposite to each other, of the device chip can be electrically connected with the substrate, and correspondingly, a scheme that the device chip supplies power through any one or two surfaces of the first surface and the second surface can be realized through the substrate.

The invention discloses a bonding agent for bonding aluminum nitride ceramics and a bonding method, and belongs to the technical field of electrostatic chucks, and the bonding agent comprises the following components in parts by weight: 1.5-5.5 wt% of B2O3, 40-55 wt% of CaO, 40-55 wt% of AI2O3, an organic solvent, a dispersant and a binder. The bonding method comprises the steps that a first aluminum nitride sintered body and a second aluminum nitride sintered body which are bonded are prepared, the bonding face of the first aluminum nitride sintered body and the bonding face of the second aluminum nitride sintered body need to be machined firstly, alcohol serves as a cleaning agent, and ultrasonic cleaning is conducted for 30 min or above; the preparation method comprises the following steps: respectively weighing B2O3, CaO and AI2O3 according to a ratio, putting the weighed B2O3, CaO and AI2O3 together with an organic solvent, a dispersant and a binder into a ball milling tank, and carrying out ball milling for 4-6 hours to form a binding agent; the bonding agent is uniformly coated on the bonding surface of the first aluminum nitride sintered body and the second aluminum nitride sintered body, the thickness of the bonding agent is 90-110 [mu] m, bonding is carried out, the load of 10 kg / cm < 2 > is applied, nitrogen is filled at the temperature of 1200 DEG C for atmosphere protection, the bonding temperature is 1400-1800 DEG C, and the bonding time is 20-50 min.

The invention discloses a multi-layer composite modified polypropylene electric power pipe and a preparation method thereof, belonging to the technical field of composite electric power pipelines. The multi-layer composite modified polypropylene electric power pipe comprises an inner layer, a foaming layer and an outer layer arranged in sequence from the inside to the outside; the inner layer, the foaming layer and the outer layer all comprise modified fillers, and the modified fillers are inorganic mixtures sequentially subjected to ultrasonic cavitation treatment, cryogenic treatment and coupling agent surface treatment, and the inorganic mixture is a mixture of nano calcium carbonate, silicon carbide and nano silicon nitride. The obtained multi-layer composite modified polypropylene electric power pipe has good bonding between layers, is not easy to delaminate even under heavy pressure, and after the multi-section composite pipe is welded, the joints also have good drag strength.

The adhesive contains a polymer (X1) containing 48 mass% or more of a structural unit derived from at least one monomer (Y) selected from the group consisting of a monomer (A1) represented by general formula (1) and a monomer (B1) represented by general formula (2), when the storage modulus at 23 DEG C is G '(23 DEG C) and the loss modulus at 23 DEG C is G' (23 DEG C), the tan [delta] (23 DEG C) calculated by G '(23 DEG C) / G' (23 DEG C) is 0.8-1.3. In formula (1), R1 represents H or CH3, R2 represents-CnH2n + 1, n represents an integer of 7-14, and in formula (2), R3 represents-C (= O) CmH2m + 1, and m represents an integer of 6-13. By this means, it is possible to improve the biological rate and, at the same time, to improve the holding power at high temperatures, adhesion at low temperatures, and adhesiveness with respect to a low-polarity adherend. # imgabs0 #

This invention discloses an Angiopep-2 modified fluorescent polyamide-amine dendritic polymer and its preparation method, as well as a method for preparing nanoparticles based thereon, belonging to the field of nanomaterials technology. The preparation method includes the following steps: mixing the polyamide-amine dendritic polymer with a first phosphate buffer to obtain solution I; mixing maleimide-polyethylene glycol-N-hydroxysuccinimide with the first phosphate buffer to obtain solution II; mixing solution I and solution II and reacting them, followed by ultrafiltration purification to obtain intermediate A; dissolving Angiopep-2 in a second phosphate buffer and reacting it with intermediate A, followed by freeze-drying to obtain intermediate B; dissolving intermediate B in a dimethyl sulfoxide solution to obtain solution III; dissolving fluorescein isothiocyanate in a dimethyl sulfoxide solution to obtain solution IV; mixing solutions III and IV and reacting them under a protective gas atmosphere in the dark; freeze-drying to obtain the Angiopep-2 modified fluorescent polyamide-amine dendritic polymer.

The invention discloses a packaging structure and a packaging method. The packaging structure comprises a substrate; the interconnection structure is bonded on the substrate, the interconnection structure comprises a rewiring layer and a chip bridge embedded in the rewiring layer, the interconnection structure comprises a bonding surface, and the bonding surface is exposed out of the surface of the chip bridge; the first chip is bonded on the bonding surface of the interconnection structure, and the first chip is electrically connected with the rewiring layer and the chip bridge; and the chip structure is bonded on the bonding surface of the interconnection structure at the side part of the first chip, the chip structure is electrically connected with the rewiring layer, and the chip structure is electrically connected with the first chip through a chip bridge. The packaging effect of the packaging structure can be improved.

The invention relates to the technical field of copper-copper bonding, in particular to a copper-copper bonding structure and a bonding method thereof.The copper-copper bonding structure comprises a first copper material and a second copper material, a plurality of copper columns are arranged on the bonding face of the first copper material in an array mode, and a plurality of pits used in cooperation with the copper columns are formed in the bonding face of the second copper material in an array mode; the recess is of an inverted quadrangular frustum pyramid structure; according to the invention, the copper column is designed to be matched with the recess of the quadrangular frustum pyramid structure, so that the pressure intensity of a contact area is increased, the copper-copper bonding process is optimized, the bonding process does not need to depend on a method of removing an oxide layer, the chemical risk in a working environment can be effectively reduced, and the health and safety of operators are ensured; the recess is prepared by a wet etching technology, and has a flat inclined surface and excellent high temperature resistance. Not only is the contact surface area increased, but also the pressure intensively applied by the copper column can be effectively guided, so that a high-voltage contact point is formed, and the reliability and stability of connection can be further improved.

The present invention discloses a wire bonding device and method based on ultrafast laser ablation, which relates to the field of ultrafast laser welding application technology. The device includes an ultrafast laser processing system, a fixture and a positioning system. An ultrafast laser is used to generate an ultrafast pulse beam of femtosecond magnitude, and the laser path is adjusted by a reflector. Then, the incident laser beam is focused on the sample surface by a galvanometer and focusing mirror system. Then, the gold wire is positioned by microscopic imaging of a camera so that it is close to the sample surface. Then, the laser is turned on to achieve ablation and sputtering on the sample surface according to a specified path. The sputtering generated by the metal material under femtosecond laser ablation will partially adhere to the edge of the contact between the gold wire and the metal surface and gradually deposit. Then, the high-temperature melt heats the gold wire and the metal surface through heat conduction to form a bond, thereby forming a stable weld. The present invention improves the strength and efficiency of wire bonding.

The purpose of the present invention is to provide: a fiber treatment agent for rubber reinforcement, which does not contain resorcinol or formaldehyde; a fiber treatment agent set for rubber reinforcement; and a fiber for rubber reinforcement, which has excellent adhesiveness with a rubber composition, and a rubber product. The present invention relates to a fiber treatment agent for rubber reinforcement, which does not contain resorcinol or formaldehyde and contains a polycarboxylic acid polymer, an epoxy compound, a rubber emulsion having a structure derived from vinylpyridine in a polymer molecule, and a blocked isocyanate compound.

The adhesive contains a polymer (X1) containing 48 mass% or more of a structural unit derived from at least one monomer (Y) selected from the group consisting of a monomer (A1) represented by general formula (1) and a monomer (B1) represented by general formula (2), when the storage modulus at 23 DEG C is G '(23 DEG C) and the loss modulus at 23 DEG C is G' (23 DEG C), the tan [delta] (23 DEG C) calculated by G '(23 DEG C) / G' (23 DEG C) is 0.8-1.3. In formula (1), R1 represents H or CH3, R2 represents-CnH2n + 1, n represents an integer of 7-14, and in formula (2), R3 represents-C (= O) CmH2m + 1, and m represents an integer of 6-13. By this means, it is possible to improve the biological rate and, at the same time, to improve the holding power at high temperatures, adhesion at low temperatures, and adhesiveness with respect to a low-polarity adherend. # imgabs0 #

The present invention relates to a coding device and a combined nozzle thereof, wherein the combined nozzle comprises a first nozzle and a second nozzle capable of working simultaneously, wherein the deflection electric field of the first nozzle is opposite to the direction of the deflection electric field of the second nozzle, and when the target pattern is collaboratively printed, the intersection of the projection lines of the flight trajectories of the charged ink droplets used by the first nozzle and the second nozzle for printing the target pattern on a third plane is located on the projection line of the printing surface of the substrate on the third plane, so that each printing column constituting the target pattern can be completed simultaneously, wherein the third plane is perpendicular to the first plane and perpendicular to the second plane; the first plane is parallel to the printing surface, and the second plane is perpendicular to the moving direction of the substrate. The coding device and the combined nozzle thereof proposed by the present invention can complete each printing column constituting the target pattern simultaneously regardless of how the moving speed of the substrate changes, so the upper and lower parts of the target pattern can always be aligned left and right.

Disclosed are a separator-integrated electrode, a method of manufacturing the same, and an electrode assembly and a rechargeable lithium battery including the same. The separator-integrated electrode includes an electrode and a polymer fiber layer on the electrode. The polymer fiber layer comprises polyacrylic acid. The polymer fiber layer has a tensile strength in the MD direction of greater than or equal to about 120 kgf / cm2. The polymeric fiber layer has an air permeability of less than or equal to about 500 sec / 100 cc.

The invention provides a micro-fluidic sorting chip, a micro-fluidic sorting system and a micro-fluidic sorting method. The micro-fluidic sorting chip comprises a cover plate, a substrate and an extrusion film, the cover plate and the substrate are covered to form a transmission channel, and the cover plate is provided with a sample inlet, a non-target particle outlet, at least one target particle outlet and at least one extrusion hole; one end of the transmission channel is communicated to the sample inlet, and the other end of the transmission channel is respectively communicated to the extrusion hole, the non-target particle outlet and the target particle outlet; the extrusion film and the extrusion hole form an extrusion cavity, the extrusion cavity has an extrusion state and a non-extrusion state, the solution is guided to the target particle outlet in the extrusion state, and the solution is guided to the non-target particle outlet in the non-extrusion state; and an electrode layer is arranged on the substrate and is used for being externally connected with an impedance detection module so as to detect the impedance of particles in the solution to control the piezoelectric actuator to switch the state of the extrusion cavity. The micro-fluidic sorting chip provided by the invention can simplify the sorting process, and is small in size and convenient to manufacture.

The invention provides a preparation method of a cellulose-based ZIFs / GO composite material with a sandwich structure, and relates to the technical field of adsorption material preparation. The method comprises the following steps: by taking graphene oxide with polyhydroxy and carboxyl as a carrier, firstly complexing metal ions Co < 2 + >, then mixing with a cellulose nanofibril (CNF) dispersion liquid, and mixing with a ligand solution through an in-situ growth method to prepare a ZIFs / CNF / GO composite material; the ZIF-67 / CNF / GO composite material has the advantages of high adsorption capacity and high repeated utilization rate.

The invention relates to the field of micro electro mechanical systems, in particular to a micro electro mechanical system structure and a preparation method, the micro electro mechanical system structure comprises a bearing layer and a covering layer which are stacked and bonded with each other, a plurality of bonding parts are formed on the surface, close to the covering layer, of the bearing layer, and the covering layer covers the bearing layer and is tightly connected through the bonding parts. A plurality of through holes are formed in the surface of the covering layer, the through holes are used for communicating the two sides of the covering layer, the covering layer comprises a target area and a plurality of detection areas, the depth of the detection areas is consistent with that of the through holes in the target area, the detection areas of the covering layer can be separated from the bearing layer through a mechanical method, and / or the detection areas are formed in a non-functional area of the micro-electro-mechanical structure. Through holes with the same depth are formed in the detection area with the structure not affecting the product function, and the depth of the through holes in the detection area is obtained through destructive testing, so that the etching condition of the through holes in the functional area is judged, the universality is high, the product is not damaged, and the cost is low.

The invention discloses a UV primer coating method for a tinplate can and a surface-treatment-free UV primer for the tinplate can. The method comprises the steps that S1, the UV primer is prepared; s2, the surface, not subjected to surface oil removal treatment, of the tinplate can is directly coated with UV primer; and S3, ultraviolet light with the energy higher than 350 mJ / m < 2 > is adopted for curing the surface, coated with the primer, of the tinplate can till the surface is completely dried. The UV primer provided by the scheme can ensure that the tin can still has good adhesive force under the condition that the tin can is not subjected to oil removal pretreatment, and meanwhile, the UV primer has excellent scratch resistance, saline-alkaline water resistance, impact resistance and short curing speed.

Provided is a method for producing a joined body obtained by joining a base material A, a film containing an amorphous thermoplastic resin, which is at least one of a thermoplastic epoxy resin and a phenoxy resin, as a main component, and a resin B in this order. The method includes a first joining step of joining the base material A and the film by melting and then solidifying the film in a state in which the film is in contact with the base material A, and a second joining step of joining the base material A and the resin B by melting and then solidifying the film in a state in which the film joined to the base material A is in contact with the resin B. The base material A is at least one of a metal and an inorganic substance, an epoxy equivalent of the amorphous thermoplastic resin is 1,600 g / eq. or more, or the amorphous thermoplastic resin does not contain an epoxy group, and a heat of fusion of the amorphous thermoplastic resin is 15 J / g or less.