Method for manufacturing microwave thin film attenuator
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- THE 41ST INST OF CHINA ELECTRONICS TECH GRP
- Publication Date
- 2014-01-29
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
Technical field
[0001] The invention relates to a microwave attenuator, in particular to a manufacturing method of a microwave thin film attenuator, and belongs to the technical field of attenuators. Background technique
[0002] The attenuator used in the microwave frequency band mainly adopts two transmission line structure forms: one adopts a sling line structure, which is mainly used in microwave components such as programmable step attenuators and coaxial fixed attenuators; the other adopts a microstrip line structure Although it can be packaged separately as a microwave module, it is more used in microwave active components, mainly to achieve the matching between the internal circuits of the components, improve the standing wave ratio of the ports, increase the power of the components, and adjust the amplifier gain. The attenuator of the microstrip line structure is small in size, requires a small standing wave ratio, good attenuation frequency response, and high mutual ind...