A multi-layer circuit board high-frequency electromagnetic fusion machine

A multi-layer circuit board, high-frequency electromagnetic technology, applied in multi-layer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve the problems of lack of buffer in the fusion structure, troublesome adjustment of high-frequency electromagnetic fusion machine, etc., and achieve the goal of reducing impact Effect

Active Publication Date: 2022-05-24
深圳市美瑞安科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a multi-layer circuit board high-frequency electromagnetic fusion machine, through the fusion mechanism, adjustment mechanism and machine base, to solve the problems of the existing high-frequency electromagnetic fusion machine adjustment troubles and fusion structure lack of buffer

Method used

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  • A multi-layer circuit board high-frequency electromagnetic fusion machine
  • A multi-layer circuit board high-frequency electromagnetic fusion machine
  • A multi-layer circuit board high-frequency electromagnetic fusion machine

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Embodiment Construction

[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0026] see Figure 1-5 As shown, the present invention is a multi-layer circuit board high-frequency electromagnetic fusion machine, including a fusion mechanism 1, an adjustment mechanism 2 and a base 3, the fusion mechanism 1 is fixedly connected to one side of the adjustment mechanism 2, and the fusion mechanism 1 The crankshaft 102 is movably connected to the inside of the casing 202 in the adjustment mechanism 2, and is used to retain the mobility of the crankshaft 102 by the way that the crankshaft 102 is movably connected to the inside of the casing 202. The fusion mechanism 1 includes a fixing plate 103, Adjusting column 104 and connecting plate 105, the penetration of adjusting column 104 is fixedly connected to connecting plate 105 through fixing plate 103, ...

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Abstract

The invention discloses a multilayer circuit board high-frequency electromagnetic fusing machine, which relates to the technical field of electronic circuits. The invention includes a fusion mechanism, an adjustment mechanism and a machine base, wherein the fusion mechanism is fixedly connected to one side of the adjustment mechanism, the fusion mechanism includes a fixed plate, an adjustment column and a connection plate, and the adjustment column passes through the fixed plate and is fixedly connected to the connection plate. The lower part of the adjustment mechanism is fixedly connected with the machine base. The adjustment mechanism includes a tooth plate, a gear, a connecting shaft and a motor. One side of the tooth plate is meshed with the gear, one end of the gear is fixedly connected with the connecting shaft, and one end of the connecting shaft is fixedly connected with the motor. . The invention solves the problems of troublesome adjustment of the existing high-frequency electromagnetic fusion machine and lack of buffer in the fusion structure through the fusion mechanism, the adjustment mechanism and the machine base.

Description

technical field [0001] The invention belongs to the technical field of electronic circuits, in particular to a high-frequency electromagnetic fusion machine for multilayer circuit boards. Background technique [0002] High-frequency electromagnetic heat sealing machine is the preferred equipment for heat sealing of various structures. Therefore, the high-frequency electromagnetic heat sealing machine is the first choice for the fusion of some materials, and when the multi-layer circuit board is fused, a high-frequency electromagnetic heat sealing machine is also required, but the existing high-frequency electromagnetic heat sealing machine is used in practice. There are still the following disadvantages: [0003] 1. The height of the fusion fuselage of the existing high-frequency electromagnetic heat sealing machine is generally fixed, which limits the height requirements of some materials. Only the welding of materials with a specific height can be performed, which will re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/00
CPCH05K3/4611H05K3/0044H05K2203/068
Inventor 陈法军
Owner 深圳市美瑞安科技有限公司
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