Self-adhesive multi-layer silica gel sticking process
A self-adhesive, silicone technology, applied in the direction of cleaning methods using tools, chemical instruments and methods, cleaning methods and utensils, etc., can solve the problems of high cost and low efficiency of manual processing of silicone, so as to reduce labor costs, glue sticking, etc. High efficiency and stable glue quality
Active Publication Date: 2021-10-15
SUZHOU KECHUAN ELECTRONICS TECH
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Problems solved by technology
[0005] For this reason, the technical problem to be solved by the present invention is to overcome the defects of low efficiency and high cost of manual
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[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the examples given are not intended to limit the present invention.
[0033] refer to figure 1 As shown, the self-adhesive multi-layer silica gel sticking process of the present invention comprises the following steps:
[0034] Place the silica gel roll on the unwinding device 1, the unwinding speed of the silica gel is v,
[0035] v=[3-A(T / T 0 ) 3 +B(φ 0 / φ) 2 ]v 0 ,
[0036] Among them, T 0 and φ 0 is the standard ambient temperature and humidity, T and φ are the actual ambient temperature and humidity, A and B are constants, v 0 is the unwinding speed at standard ambient temperature and humidity.
[0037] Standard ambient temperature T 0 23°C, standard humidity φ 0 65%. Silica gel is resistant to high and low temperatures, and the ch...
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The invention relates to a self-adhesive multi-layer silica gel sticking process. The self-adhesive multi-layer silica gel sticking process comprises the following steps that a silica gel roll is placed on an unwinding device, the unwinding speed of silica gel is v, and v=[3-A(T/T0)<3>+B(phi0/phi)<2>]v0, wherein T0 and phi0 are standard environment temperature and humidity, T and phi are actual environment temperature and humidity, A and B are constants, and v0 is the unwinding speed under the standard environment temperature and humidity; the unwound silica gel is subjected to dirt treatment and silica gel pressing through a first surface treatment area; the unwound silica gel is subjected to viscosity treatment through a second surface treatment area; the treated silica gel is dried in a drying area and then enters a gel sticking area for gel sticking; and the silica gel subjected to gel sticking is wound through a winding device. According to the self-adhesive multi-layer silica gel sticking process, by controlling the speed of the silica gel roll in different environments, the gel sticking quality of silica gel under various actual environment temperatures and humidity is stable, the silica gel sticking device is suitable for different use environments, the gel sticking efficiency is high, and the labor cost is greatly reduced.
Description
technical field [0001] The invention relates to the technical field of silica gel production, in particular to a self-adhesive multi-layer silica gel pasting process. Background technique [0002] With the continuous improvement of material performance, the existing materials can no longer meet the needs of customers. In order to meet the performance requirements, the material is converted from ordinary foam to silicone material. Due to the characteristics of the silicone material, the surface of the product material that needs to be glued needs to be specially made. After treatment, it can be bonded with double-sided tape. [0003] The silica gel treatment process in the prior art is as follows: 1. Manually surface-treat the silica gel material, which can process 3 meters of material each time; 2. After the surface treatment of the material, the material is naturally air-dried for about 2-5 minutes before proceeding to the next end of the material Surface treatment; 3. Use...
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Patent Timeline
Login to View More IPC IPC(8): B29C65/48B29C65/78B08B1/00B08B1/02
CPCB29C65/48B29C65/7861B08B1/006B08B1/02B29C66/45
Inventor 孙绪伍金昌伟张奎杨佳文邢正辉
Owner SUZHOU KECHUAN ELECTRONICS TECH