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Smart card carrier tape blind hole electroplating method

A technology of smart card and carrier tape, which is applied in the field of electroplating, can solve the problems that blind holes cannot be plated with target metal, product failure, and the purity of the plating layer is reduced, so as to avoid the reduction of the service life of the plating solution and solve the effect of failure

Active Publication Date: 2021-12-10
新恒汇电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing electroplating process is prone to missing plating during blind hole plating, that is, the defect that the target metal cannot be plated in the blind hole, resulting in product failure
[0003] The existing process realizes blind hole electroplating by adding chemical wetting agent to the plating solution to reduce the surface tension of the plating solution. This method increases the organic content in the plating solution due to additional chemical additives, and co-deposition occurs in the plating layer, making the plating The service life of the liquid is shortened, and the purity of the plating layer is reduced, and welding failure occurs during the smart card welding process, which affects product performance

Method used

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  • Smart card carrier tape blind hole electroplating method
  • Smart card carrier tape blind hole electroplating method
  • Smart card carrier tape blind hole electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A blind bore-plated nickel carrier belt with a length of 3 meters is used as a base material product, and the plating product is used for soft gold plating after removing oil and activation.

[0028] File gold plating liquid is selected from the soft gold medicine water, the plating temperature of 65 ° C, the gold salt concentration 10g / L.

[0029] like Figure 3-4 As shown, the spray device 3 extracts the gold plating liquid in the plating tank 4, set the temperature of 65 ° C, injection pressure 10bar, and the injection flow rate 50L / min, and the carrier tape 1 is subjected to the carrier tape 1 in the position of 4 m / min. The blind hole 2 is sufficiently infiltrating; the product is continuously entered into the plating tank 4 in the same speed; the electroplating flexural plating current is selected from 1a, the plating bath is effective for electroplating time 20s, and the product is dried after electroplating.

Embodiment 2

[0031] The nickel-plated nickel carrier belt with a length of 3 meters is used as a base material. After removing oil, the electroplated product is used for soft gold plating.

[0032] File gold plating liquid is selected from the soft gold medicine water, the plating temperature of 65 ° C, the gold salt concentration 10g / L.

[0033] like Figure 3-4 As shown, the spray device 3 extracts the gold plating solution in the plating tank 4, set the temperature of 65 ° C, injection pressure 2bar, and the injection flow rate of 10 L / min, and the carrier tape 1 is subtracted in the production speed of 4 m / min. The blind hole 2 is sufficiently infiltrating; the product is continuously entered into the plating tank 4 in the same speed; the electroplating flexural plating current is selected from 1a, the plating bath is effective for electroplating time 20s, and the product is dried after electroplating.

Embodiment 3

[0035] The nickel-plated nickel carrier belt with a length of 3 meters is used as a base material. After removing oil, the electroplated product is used for soft gold plating.

[0036] File gold plating liquid is selected from the soft gold medicine water, the plating temperature of 65 ° C, the gold salt concentration 10g / L.

[0037] like Figure 3-4 As shown, the spray device 3 extracts the gold plating liquid in the plating tank 4, set the temperature of 65 ° C, the injection pressure 20 bar, and the injection flow rate of 100 l / min, and the carrier tape 1 is subjected to the carrier tape 1 in the position of 4 m / min. The blind hole 2 is sufficiently infiltrating; the product is continuously entered into the plating tank 4 in the same speed; the electroplating flexural plating current is selected from 1a, the plating bath is effective for electroplating time 20s, and the product is dried after electroplating.

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Abstract

The invention belongs to the field of electroplating technology, and in particular relates to a blind hole electroplating method for a smart card carrier tape. Electroplating is carried out after the pretreatment of the carrier tape, and the liquid interface is used for similar compatibility characteristics. Before the carrier tape enters the electroplating tank for electroplating, the The plating solution in the electroplating tank performs impregnation pretreatment on the blind hole area of ​​the carrier tape by power spraying, and the treated carrier tape enters the electroplating tank for electroplating. The invention provides a physical process method to solve blind hole electroplating, which avoids the problem of reduced service life of the plating solution caused by the use of chemical additives. At the same time, the invention solves the problem of failure of smart card products in terms of performance such as welding wires caused by the reduction of the purity of the plating layer. .

Description

Technical field [0001] The present invention belongs to the field of electroplating, and more particularly to a smart cardboard belt blind hole plating method. Background technique [0002] Smart card belts need to electroplate, nickel, gold, etc. other metals such as copper, nickel, gold in the production process. Due to the design characteristics of the carrier product, some plating positions are planar electroplating, and some plating positions are blind-plated. Existing plating processes are prone to leakage in blind holes, that is, the defects of the target metal cannot be plated in the blind hole, resulting in failure of the product. [0003] The existing process achieves blind hole electro-plating by reducing the surface tension of the plating solution in the plating solution, which causes an additional chemical additive to increase the content of the organic matter in the plating solution, and a total deposition in the plating layer makes plating The liquid life is shorte...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/06C25D5/00
CPCC25D7/0685C25D5/00
Inventor 张成彬刘恺陈庆颖王毅
Owner 新恒汇电子股份有限公司