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Semiconductor packaging structure and forming method thereof

A packaging structure, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as discontinuity of the seed layer, and achieve the effect of improving yield

Pending Publication Date: 2022-02-18
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of the problems existing in the related art, the object of the present invention is to provide a semiconductor packaging structure and its forming method to solve the problem of discontinuous seed layer

Method used

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  • Semiconductor packaging structure and forming method thereof
  • Semiconductor packaging structure and forming method thereof
  • Semiconductor packaging structure and forming method thereof

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Embodiment Construction

[0031] The following summary provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, in the following description, forming a first component over or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which a first component may be formed between the first component and the second component. Additional components such that the first and second components may not be in direct contact. In addition, the present invention may repeat reference numerals and / or characters in various instances. This repetition is for the purposes of simplicity and clarity and does not in itself indicate a relationship between the...

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Abstract

The embodiment of the invention relates to a semiconductor packaging structure and a forming method thereof. The semiconductor package structure includes a substrate and a circuit layer over the substrate. The semiconductor packaging structure further comprises an adhesive layer located between the substrate and the circuit layer, and the adhesive layer comprises a bearing part extending to the side wall of the circuit layer. Due to the existence of the bearing part, the bearing part can compensate the overlarge segment difference between the circuit layer and the adhesive layer, so that the deposited crystal seed layer can be continuous.

Description

technical field [0001] The invention relates to a semiconductor packaging structure and a forming method thereof. Background technique [0002] In the manufacturing process of semiconductor package structures such as fan-out substrate (FOSUB), such as Figure 1A and Figure 1B As shown, after the fan-out (fan-out) layer 30 is bonded to the substrate 10 through the adhesive layer 20, a through hole (through via) will be plated to electrically connect the fan-out layer 30 and the substrate 10, and a crystal will be formed before the plated through hole. A seed layer 40 is on the fan-out layer 30 . However, when depositing the seed layer 40 using a physical vapor deposition (PVD) process, due to the design of the scribe line of the fan-out layer 30, the sidewall of the fan-out layer 30 cannot be completely covered by the seed layer 40 during the PVD process, such as Figure 1A in area 22 and Figure 1B As shown in the region 32 in , it will affect the subsequent electroplatin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48
CPCH01L23/49822H01L23/49827H01L23/49894H01L23/49838H01L21/4857H01L21/486H01L2224/0231H01L2224/02379H01L2224/02381H01L2224/02331
Inventor 黄文宏
Owner ADVANCED SEMICON ENG INC