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Electroplating method for carrier tape blind hole of smart card

A technology of smart card and carrier tape, applied in the field of electroplating, can solve the problems of product failure, blind holes cannot be plated with target metal, affecting product performance, etc., to solve the failure and avoid the effect of reducing the life of the plating solution

Active Publication Date: 2021-10-19
新恒汇电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing electroplating process is prone to missing plating during blind hole plating, that is, the defect that the target metal cannot be plated in the blind hole, resulting in product failure
[0003] The existing process realizes blind hole electroplating by adding chemical wetting agent to the plating solution to reduce the surface tension of the plating solution. This method increases the organic content in the plating solution due to additional chemical additives, and co-deposition occurs in the plating layer, making the plating The service life of the liquid is shortened, and the purity of the plating layer is reduced, and welding failure occurs during the smart card welding process, which affects product performance

Method used

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  • Electroplating method for carrier tape blind hole of smart card
  • Electroplating method for carrier tape blind hole of smart card
  • Electroplating method for carrier tape blind hole of smart card

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A blind-hole nickel-plated carrier tape with a length of 3 meters is used as the base product. After degreasing and activation treatment, the electroplated product is subjected to soft gold electroplating.

[0028] The soft gold plating solution is selected from the soft gold solution of Dewen Electronic Materials Co., Ltd., the temperature of the plating solution is 65°C, and the concentration of gold salt is 10g / L.

[0029] Such as Figure 3-4 As shown, the spray device 3 extracts the gold plating solution in the electroplating tank 4, sets the temperature at 65°C, sprays the pressure at 10 bar, and sprays the flow rate at 50 L / min, and performs infiltration pretreatment on the carrier tape 1 at a production speed of 4 m / min, so that The blind hole 2 is fully soaked in the plating solution; the product enters the electroplating tank 4 continuously at the same speed for electroplating; the electroplating current for soft gold is 1A, the effective plating time of the pl...

Embodiment 2

[0031] A blind-hole nickel-plated carrier tape with a length of 3 meters is used as the base product. After degreasing and activation, the electroplated product is subjected to soft gold electroplating.

[0032] The soft gold plating solution is selected from the soft gold solution of Dewen Electronic Materials Co., Ltd., the temperature of the plating solution is 65°C, and the concentration of gold salt is 10g / L.

[0033] Such as Figure 3-4 As shown, the spray device 3 extracts the gold plating solution in the electroplating tank 4, sets the temperature at 65°C, sprays the pressure at 2 bar, and sprays the flow rate at 10 L / min. The carrier tape 1 is soaked and pretreated at the production speed of 4 m / min, so that The blind hole 2 is fully soaked in the plating solution; the product enters the electroplating tank 4 continuously at the same speed for electroplating; the electroplating current for soft gold is 1A, the effective plating time of the plating tank is 20s, and the...

Embodiment 3

[0035] A blind-hole nickel-plated carrier tape with a length of 3 meters is used as the base product. After degreasing and activation, the electroplated product is subjected to soft gold electroplating.

[0036] The soft gold plating solution is selected from the soft gold solution of Dewen Electronic Materials Co., Ltd., the temperature of the plating solution is 65°C, and the concentration of gold salt is 10g / L.

[0037] Such as Figure 3-4 As shown, the spray device 3 extracts the gold plating solution in the electroplating tank 4, sets the temperature at 65°C, sprays the pressure at 20 bar, and sprays the flow rate at 100 L / min. The carrier tape 1 is soaked and pretreated at the production speed of 4 m / min, so that The blind hole 2 is fully soaked in the plating solution; the product enters the electroplating tank 4 continuously at the same speed for electroplating; the electroplating current for soft gold is 1A, the effective plating time of the plating tank is 20s, and t...

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Abstract

The invention belongs to the technical field of electroplating, and particularly relates to an electroplating method for a carrier tape blind hole of a smart card. The electroplating method comprises the following steps of: electroplating a carrier tape after pretreatment; by utilizing the similar compatibility characteristic of a liquid interface, before the carrier tape enters an electroplating bath for electroplating, firstly carrying out infiltration pretreatment on a blind hole area of the carrier tape by adopting a plating solution in the electroplating bath through power spraying; and then enabling the treated carrier tape to enter the electroplating bath for electroplating. The invention provides a physical process method for solving the electroplating of the blind hole, so that the problem that the service life of the plating solution is shortened due to the use of a chemical additive is avoided; and meanwhile, the problem that the performances such as a welding wire of a smart card product are invalid due to the reduction of the purity of a plating layer is solved.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to an electroplating method for a blind hole of a smart card carrier tape. Background technique [0002] During the production process of the smart card carrier tape, copper, nickel, gold and other metals need to be electroplated on the carrier tape. Due to the design characteristics of carrier tape products, some plating positions are planar plating, and some plating positions are blind hole plating. The existing electroplating process is prone to missing plating during blind hole electroplating, that is, the defect that the target metal cannot be electroplated in the blind hole, resulting in product failure. [0003] The existing process realizes blind hole electroplating by adding a chemical wetting agent to the plating solution to reduce the surface tension of the plating solution. This method increases the organic content in the plating solution due to addit...

Claims

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Application Information

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IPC IPC(8): C25D7/06C25D5/00
CPCC25D7/0685C25D5/00
Inventor 张成彬刘恺陈庆颖王毅
Owner 新恒汇电子股份有限公司