A kind of HDI board drilling depth detection equipment and detection method

Abstract

The invention discloses an HDI board drilling depth detection device and a detection method thereof. A waist-shaped groove (6) connected to a sinking groove (5) is opened on the left side wall of a positioning seat (2), and the positioning seat (2) An adjustment cylinder (7) is also fixed on the left outer wall, the adjustment cylinder (7) is arranged below the waist-shaped groove (6), and an insulating seat (8) is fixed on the active end of the piston rod of the adjustment cylinder (7). The insulating seat (8) is set in the waist-shaped groove (6), the right end of the horizontal copper column (9) extends in the sinker (5), and the left end of the horizontal copper column (9) extends to the bottom of the insulating seat (8). On the outside, a clamping cylinder (10) is fixed on the right side wall of the positioning seat (2), the piston rod of the clamping cylinder (10) extends into the sinker (5), and the extension end is fixed with a Push plate (11). The beneficial effects of the invention are: compact structure, improved blind hole depth detection efficiency, reduced work intensity of workers, and improved hole depth detection accuracy.

Description

technical field [0001] The invention relates to the technical field of detecting the depth of blind holes after HDI boards are processed by laser, in particular to an HDI board drilling depth detection device and a detection method thereof. Background technique [0002] High-density interconnect printed circuit boards are also called HDI boards. The demand for HDI boards is increasing, the number of layers is increasing, and the thickness of the insulating medium is getting smaller and smaller. The structure of a qualified HDI board is as follows: figure 1 As shown, the first conductive circuit layer 29 and the second conductive circuit layer 30 are arranged therein, between the first conductive circuit layer 29 and the second conductive circuit layer 30, the top of the first conductive circuit layer 29, the second conductive circuit layer An insulating layer 31 is disposed on the bottom of the layers 30 , and a plurality of blind holes 32 are disposed on the top surface of...

AI Technical Summary

Problems solved by technology

However, although this method of manually detecting the hole depth with a through-rod can reject unqualified products, in the actual quality inspection process, the following technical defects often occur: 1. The diameter of the blind hole is small, so the corresponding through-hole The diameter of the rod is also made small, the corresponding scale size is difficult to read, and the problem of reading errors often occurs, which leads to the mixing of unqualified products into qualified products, which not only increases the work intensity of workers, but also has inspection accuracy. low defect

2. The number of blind holes to be tested on an HDI board is as many as 8~12. The workers use the through rod to measure one by one, which undoubtedly increases the quality inspection time of a single HDI board, thereby greatly reducing the cost. Quality inspection efficiency

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