HDI plate drilling depth detection equipment and detection method thereof

Abstract

The invention discloses HDI plate drilling depth detection equipment and a detection method thereof. The left side wall of a positioning seat (2) is provided with a kidney-shaped groove (6) communicated with a sinking groove (5), the outer wall of the left side of the positioning seat (2) is further fixedly provided with an adjusting air cylinder (7), the adjusting air cylinder (7) is arranged below the kidney-shaped groove (6), and the acting end of a piston rod of the adjusting air cylinder (7) is fixedly provided with an insulating seat (8), the insulating seat (8) is arranged in the kidney-shaped groove (6), the right end of the horizontal copper column (9) extends into the sinking groove (5), the left end of the horizontal copper column (9) extends to the outer side of the insulating seat (8), a clamping air cylinder (10) is fixedly arranged on the right side wall of the positioning seat (2), a piston rod of the clamping air cylinder (10) extends into the sinking groove (5), and a push plate (11) is fixedly arranged at the extending end of the clamping air cylinder (10). The equipment has the advantages of being compact in structure, improving the blind hole depth detection efficiency, reducing the working intensity of workers and improving the hole depth detection precision.

Description

technical field [0001] The invention relates to the technical field of detecting the depth of blind holes after HDI boards are processed by laser, in particular to an HDI board drilling depth detection device and a detection method thereof. Background technique [0002] High-density interconnect printed circuit boards are also called HDI boards. The demand for HDI boards is increasing, the number of layers is increasing, and the thickness of the insulating medium is getting smaller and smaller. The structure of a qualified HDI board is as follows: figure 1 As shown, the first conductive circuit layer 29 and the second conductive circuit layer 30 are arranged therein, between the first conductive circuit layer 29 and the second conductive circuit layer 30, the top of the first conductive circuit layer 29, the second conductive circuit layer An insulating layer 31 is disposed on the bottom of the layers 30 , and a plurality of blind holes 32 are disposed on the top surface of...

AI Technical Summary

Problems solved by technology

However, although this method of manually detecting the hole depth with a through-rod can reject unqualified products, in the actual quality inspection process, the following technical defects often occur: 1. The diameter of the blind hole is small, so the corresponding through-hole The diameter of the rod is also made small, the corresponding scale size is difficult to read, and the problem of reading errors often occurs, which leads

Images