Automatic solder paste adding device of full-automatic solder paste printing machine

Abstract

The invention discloses an automatic solder paste adding device of a full-automatic solder paste printing machine, relates to the technical field of automatic solder paste adding of solder paste printing machines, and aims to solve the problems that existing solder paste adding depends on manual adding, the amount of added solder paste is inconvenient to control during manual adding, a large amount of solder paste is prone to being exposed on a workbench for a long time, and therefore the quality of a printed circuit board in the later stage is influenced. A storage tank is fixedly mounted in a mounting hole in the outer surface of a supporting frame, a mounting plate is fixedly connected to an opening in the upper end of the storage tank, an adjusting bevel gear is rotatably mounted in a mounting hole of the mounting plate, a screw rod is connected in the interior of a through hole in the middle axis position of the adjusting bevel gear through threads, one end of the screw rod is fixedly connected with a piston plate, the piston plate is located in the interior of the storage tank, and the lower end face of the storage tank is fixedly connected with a communicating pipe.

Description

technical field [0001] The invention relates to the technical field of automatic solder paste adding for a solder paste printing machine, in particular to an automatic solder paste adding device for a fully automatic solder paste printing machine. Background technique [0002] Modern solder paste printing machines are generally composed of plate loading, solder paste, embossing, and circuit board delivery. Its working principle is: first fix the circuit board to be printed on the printing positioning table, and then the left and right scrapers of the printing machine Print the solder paste or red glue on the corresponding pads through the stencil, and input the uniform printed PCB to the placement machine through the transmission table for automatic placement. During the operation of the solder paste printing machine, it is necessary to ensure that the solder paste Sufficient amount, so frequent addition of solder paste is required. [0003] The existing solder paste additi...

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Problems solved by technology

[0004] The purpose of the present invention is to provide an automatic solder paste adding device for a fully automatic solder paste printing machine to solve the problem that the existing solder paste addition in the above-mentioned background technology relies on manual addition, and it is inconvenient to control the amount of solder paste added during manual addition, which is easy There is a problem that a large amount of solder paste is exposed on the workbench for a long time, which affects the quality of the printed circuit board in the later stage

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