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Middle frame assembly, middle frame assembly processing method and electronic device

A processing method and technology for electronic devices, which can be applied to electrical equipment casings/cabinets/drawers, circuits, telephone communications, etc., and can solve problems such as occupied space and difficulty in connecting structural parts.

Active Publication Date: 2021-11-09
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, riveting is generally done by means of rivets. Through holes are processed on the middle frame and the bearing plate respectively, and the middle frame and the bearing plate are fixedly connected by rivets. However, since the rivets need to occupy space, therefore, Make it more difficult to connect structural parts in a narrow space

Method used

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  • Middle frame assembly, middle frame assembly processing method and electronic device
  • Middle frame assembly, middle frame assembly processing method and electronic device
  • Middle frame assembly, middle frame assembly processing method and electronic device

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the accompanying drawings in the embodiments of the application. Apparently, the described embodiments are only part of the embodiments of the application, not all of them. Based on the implementation manners in this application, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0025] see figure 1 , figure 1 It is a schematic structural diagram of a middle frame assembly provided in Embodiment 1 of the present application. The middle frame assembly 10 is applied to the electronic device 1 . In one embodiment, the middle frame assembly 10 includes a middle frame 100 and a carrier board 200 . The middle frame 100 and the carrier board 200 are described in detail as follows.

[0026] The middle frame 100 includes a frame b...

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Abstract

The invention provides a middle frame assembly, a middle frame assembly processing method and an electronic device. The middle frame assembly is applied to the electronic device, and the middle frame assembly comprises a middle frame and a bearing plate; the middle frame comprises a frame body, the frame body comprises a first surface and a second surface which are oppositely arranged, and at least one first through hole penetrating through the first surface and the second surface is formed in the frame body; the bearing plate comprises a bearing body and at least one first extension part, the bearing body comprises a third surface and a fourth surface which are oppositely arranged, the first extension part extends out of the third surface and penetrates through the first through hole, the first surface and the third surface are arranged in an attached mode, and a gap is formed between the first extension part and the frame body; a reinforcing medium is arranged in the gap so as to connect the first extension part with the frame body; and the first extension part comprises a side edge connected to the third surface, and the angle between the side edge and a plane perpendicular to the third surface is 0.5-3 degrees. According to the middle frame assembly, the middle frame assembly processing method and the electronic device, the connection between the middle frame and the bearing plate in a narrow space becomes easy.

Description

technical field [0001] The present application relates to the field of mechanical technology, and in particular to a middle frame assembly, a processing method for the middle frame assembly, and an electronic device. Background technique [0002] The middle frame assembly generally includes a middle frame and a bearing plate. The middle frame includes a plurality of segmented frames arranged on the edge of the carrier plate, and antenna slots are formed between the end surfaces of two adjacent segmented frames. The segmented frame and the bearing plate are fixed by a riveting process, and the bearing plate is provided with a clearance area connected to the antenna slit for the antenna to radiate electromagnetic wave signals. In the prior art, riveting is generally done by means of rivets. Through holes are processed on the middle frame and the bearing plate respectively, and the middle frame and the bearing plate are fixedly connected by rivets. However, since the rivets nee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00H05K7/14H05K7/18
CPCB23P15/00H05K7/18H05K7/14H01Q1/243H04M1/0202H04M1/0277H01Q13/106B23P11/02H05K5/0017H05K5/0217
Inventor 黄富勇
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD