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Computer case assembly convenient for rapid heat dissipation

A computer and chassis technology, applied in the field of computer chassis components, can solve problems such as rising air temperature, equipment damage, and affecting normal operation of equipment, and achieve the effect of meeting the needs of use, strong practicability, and simple structure

Inactive Publication Date: 2021-12-03
THE INDAL TECH SCHOOL OF SUZHOU INDAL PARK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] With the development of human beings, human society has made great progress, and the way of life of human beings has also undergone earth-shaking changes. The industrial revolution has brought a lot to human beings, and the arrival of the information age has added color to human life. Computers are representatives of the information age. Equipment, the information age is inseparable from information technology and equipment. Computers will generate heat when they are working, which seriously affects the normal operation of the equipment. The cooling device is particularly important. The traditional way of cooling computer equipment is to open multiple cooling holes on the back of the device. For heat dissipation, rapid heat dissipation cannot be achieved. The high temperature of the computer will cause the temperature of the surrounding air to rise, which is not convenient for the heat dissipation of the computer, which will cause damage to the internal equipment for a long time and cannot meet the use requirements.

Method used

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  • Computer case assembly convenient for rapid heat dissipation
  • Computer case assembly convenient for rapid heat dissipation
  • Computer case assembly convenient for rapid heat dissipation

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Embodiment Construction

[0016] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0017] Such as Figure 1-Figure 4 As shown, a computer case assembly convenient for rapid heat dissipation includes a case body 1, a plurality of legs are symmetrically fixedly connected to the bottom surface of the case body 1, and a first housing 2 is fixedly connected to the top surface of the case body 1, so that The top surface of the first housing 2 has a plurality of heat dissipation holes, the second housing 3 is fitted and slid inside the first housing 2, and the side wall of the first housing 2 is provided with a first through hole 2 -1, the side wall of the second housing 3 is provided with a second through hole 3-1, the second through hole 3-1 communicates with the first through hole 2-1, and the top surface of the box body 1 is ring-shaped. There is a dovetail groove 1-1, and a plurality of dovetail blocks 4 are fitted and slid in ...

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Abstract

The invention discloses a computer case assembly convenient for rapid heat dissipation, which comprises a case body, a plurality of heat dissipation holes are formed in the side wall, a second gear is arranged in a through groove, two ends of an S-shaped pipe penetrate out of a first barrel body and are fixedly communicated with a second barrel body, the S-shaped pipe is fixedly connected with the first barrel body, and a plurality of heat dissipation pipes are horizontally arranged on the bottom surface of the case body. The heat dissipation pipe is arranged between the two second barrel bodies and fixedly communicated with the two second barrel bodies, the bottom surfaces of the second barrel bodies and the bottom surface of the heat dissipation pipe are located on the same plane, a transverse plate is fixedly connected into one second barrel body, the model of the three-phase asynchronous motor is Y2-80M2-4S150, the first barrel body is connected with the vertical pipe in a welding mode, the heat dissipation pipe is made of aluminum alloy materials. Entering air can be cooled while equipment in a computer is rapidly cooled, the temperature of the air entering the computer is reduced, the purpose of rapidly cooling the equipment is indirectly achieved, and the use requirement is met.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a computer case assembly that facilitates rapid heat dissipation. Background technique [0002] With the development of human beings, human society has made great progress, and the way of life of human beings has also undergone earth-shaking changes. The industrial revolution has brought a lot to human beings, and the arrival of the information age has added color to human life. Computers are representatives of the information age. Equipment, the information age is inseparable from information technology and equipment. Computers will generate heat when they are working, which seriously affects the normal operation of the equipment. The cooling device is particularly important. The traditional way of cooling computer equipment is to open multiple cooling holes on the back of the device. For heat dissipation, rapid heat dissipation cannot be achieved. The high temperature of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 朱香卫
Owner THE INDAL TECH SCHOOL OF SUZHOU INDAL PARK
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