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Method and device for wafer table levelness adjustment

A technology of wafer stage and levelness, applied in the direction of measuring devices, worktables, instruments, etc., can solve the problems of wafer machine damage and wafer stage affecting the process flow, etc.

Active Publication Date: 2021-12-07
INTEL PROD CHENGDU CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

A wafer stage that fails to meet level requirements may cause serious damage to the wafer itself and / or associated machinery while affecting the normal flow of the process

Method used

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  • Method and device for wafer table levelness adjustment
  • Method and device for wafer table levelness adjustment
  • Method and device for wafer table levelness adjustment

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Embodiment Construction

[0016] In the following description, for purposes of explanation, numerous specific details are set forth. However, it is understood that practice of the present disclosure may be practiced without these specific details. In other instances, well-known circuits, structures and techniques have not been shown in detail in order not to obscure the understanding of this description.

[0017] References throughout the specification to "one implementation," "an implementation," "example implementation," "some implementations," "various implementations," etc. mean that the described implementations of the present disclosure may include a particular feature, structure, or characteristic , however, does not mean that every implementation must contain these particular features, structures, or characteristics. Furthermore, some implementations may have some, all, or none of the features described for other implementations.

[0018] Various operations may be described as multiple discre...

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Abstract

The invention provides a method and device for wafer table levelness adjustment. According to the method in one embodiment, three-dimensional space modeling is performed on an actual plane where a work table top is located based on measured values obtained by measuring a plurality of measurement points arranged on the work table top of a wafer table; according to a preset position relation among a plurality of levelness adjusting points of the wafer table, a plane where a geometrical shape formed by the plurality of adjusting points is located is taken as a reference horizontal plane, and coordinates of the plurality of adjusting points and coordinates of a central point of the geometrical shape are calculated; the values of distances from each adjusting point in the plurality of adjusting points and the central point to the actual plane are calculated; the value of the distance from each adjusting point to the actual plane is subtracted from the distance value from the center point to the actual plane, and the adjusting distance value of each adjusting point is obtained; and the rotation angle and the rotation direction of a corresponding screw are determined according to the obtained adjusting distance value and the attribute of the screw at each adjusting point.

Description

technical field [0001] The present disclosure relates to methods and apparatus for wafer table level adjustment. Background technique [0002] A wafer stage is a mechanism used to carry wafers in the semiconductor manufacturing process. Due to the extremely high precision of the semiconductor manufacturing process, the requirements for the levelness of the wafer stage are also very high. A wafer stage that fails to meet level requirements may cause serious damage to the wafer itself and / or associated machinery while affecting the normal flow of the process. Therefore, in semiconductor manufacturing plants, it is often necessary to frequently adjust the level of the wafer stage to ensure that the corresponding specifications are met. Contents of the invention [0003] In the Summary section, a selection of concepts are introduced in a simplified form that are further described below in the Detailed Description section. This Summary is not intended to identify any key fea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B25H1/14G01B21/04
CPCB25H1/14G01B21/04
Inventor 邢徐川戴新吉
Owner INTEL PROD CHENGDU CO LTD
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