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Filtering device for drain pipe of wafer back thinning equipment and drain pipe

A technology of back thinning and filtration device, applied in filtration separation, fixed filter element filter, chemical instrument and method, etc., can solve the problems of blockage, equipment downtime, etc., and achieve the effect of reducing the cost of use

Pending Publication Date: 2021-12-17
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a filter device and a liquid discharge pipe for the liquid discharge pipe of the wafer back thinning equipment, so as to improve the existing in the prior art during the use of the wafer back thinning equipment. A large amount of crystal slag and silicon-containing dirty liquid will cause blockage at the bend corner of the discharge pipe when passing through the discharge pipe, resulting in equipment downtime

Method used

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  • Filtering device for drain pipe of wafer back thinning equipment and drain pipe
  • Filtering device for drain pipe of wafer back thinning equipment and drain pipe

Examples

Experimental program
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Effect test

Embodiment 1

[0029] This embodiment provides a filter device for the drain pipe of the thinning equipment on the back of the wafer, see the attached figure 2 , with figure 2 A schematic diagram of a drain pipe filter device for thinning equipment on the back of a wafer provided by an embodiment of the present invention. It can be clearly seen from the figure that the drain pipe filter device for thinning equipment on the back of a wafer provided in this embodiment includes: liquid level sensor A device 500, a filter screen 300, a filter container 400 provided with at least one liquid inlet 700 and at least one liquid discharge port 800; wherein, the liquid inlet 700 is arranged higher than the liquid discharge port 800; the filter screen 300 Placed in the filter container 400, and the filter screen 300 is located between the liquid inlet 700 and the liquid discharge port 800; the liquid inlet 700 is connected to the first filter for discharging unfiltered waste liquid The drain pipe 100...

Embodiment 2

[0040] The present invention also provides a liquid discharge pipe used for wafer backside thinning equipment, the liquid discharge pipe is provided with a filter device between the first liquid discharge pipe 100 and the second liquid discharge pipe 200, The filter device filters the solid debris in the waste liquid through the filter screen 300, avoiding the problem of equipment downtime due to the accumulation of solid debris in the drain pipe.

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PUM

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Abstract

The invention provides a filtering device for a drain pipe of wafer back thinning equipment and the drain pipe, the filtering device is arranged between the drain pipes, and the filtering device comprises a liquid level sensor, a filter screen, and a filter container provided with at least one liquid inlet and at least one liquid outlet; the filter screen is placed in the filter container, and the liquid level sensor is arranged on the outer side of the side wall of the filter container and located between the filter screen and the liquid inlet. According to the filtering device for the drain pipe of the wafer back thinning equipment and the drain pipe provided by the invention, solid scraps in the dirty liquid can be prevented from being accumulated and blocked in the drain pipe, and the risk of downtime of the equipment is reduced.

Description

technical field [0001] The invention relates to the field of semiconductor wafer back thinning, in particular to a filter device and a liquid discharge pipe used for the liquid discharge pipe of wafer back thinning equipment. Background technique [0002] Wafer backside thinning equipment is one of the most important links in the BSI process. The current drain pipe used in wafer backside thinning equipment does not use any filter device at the corner, but a simple drain pipe connected to the factory In the main liquid discharge pipe of the section, due to the large thickness of the back of the wafer, a large amount of crystal slag and silicon-containing dirty liquid are easily generated inside the machine, and the crystal slag and silicon-containing dirty liquid are discharged through the liquid discharge pipe. See attached figure 1 , with figure 1 It is a schematic diagram of the structure at the corner of the discharge pipe in the prior art. It can be clearly seen from t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01D29/03B01D29/60
CPCB01D29/03B01D29/605
Inventor 徐波谈仁翌
Owner SHANGHAI HUALI MICROELECTRONICS CORP