Temperature compensation method of six-dimensional force sensor

A six-dimensional force sensor and temperature compensation technology, applied in the field of sensors, can solve the problems of cumbersome compensation process, limited accuracy of hardware temperature compensation method, and high debugging cost

Active Publication Date: 2021-12-21
ZHEJIANG UNIV
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Problems solved by technology

[0005] The purpose of the present invention is to provide a temperature compensation method for a six-dimensional force sensor to solve the technical problems in

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  • Temperature compensation method of six-dimensional force sensor
  • Temperature compensation method of six-dimensional force sensor
  • Temperature compensation method of six-dimensional force sensor

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Embodiment Construction

[0041] The technical solutions of the present invention will be described below in conjunction with the drawings, which is apparent from the accompanying drawings. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art are in the range of the present invention without making creative labor premise.

[0042] In the description of the present invention, it is to be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "within", "outside", etc. The orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings, is meant to facilitate the description of the present invention and simplified description, rather than indicating or implying that the device or component must have a specific orientation. Construct and operation, so it is not understood to be the limitation of the invention. Moreover, the term "first", "second",...

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Abstract

The invention provides a temperature compensation method of a six-dimensional force sensor and relates to the technical field of sensors. The temperature compensation method of the six-dimensional force sensor comprises the following steps of acquiring input signals and output signals of the six-dimensional force sensor at different temperatures; determining structure parameters of the BP neural network; optimizing a connection weight and a threshold value of each network layer of the BP neural network by using an improved beetle antennae algorithm; and performing temperature compensation on the output of the six-dimensional force sensor by using the optimized neural network prediction model. In the prior art, problems that precision of a hardware temperature compensation method is limited, the compensation process is tedious, and debugging cost is high are solved. The method is advantaged in that the BP neural network is used for modeling the temperature compensation process, and the global optimization capability of the improved longhorn beetle algorithm is used for optimizing the structure and parameters of the neural network model.

Description

Technical field [0001] The present invention relates to the field sensors, in particular temperature compensation alternatus be optimized BP neural network algorithm six-dimensional force sensor relates to an improved. Background technique [0002] Is a six-dimensional force sensor for measuring X, Y, Z sensors forces and moments in the three directions. Six-axis force sensor according to the measurement principle into strain, capacitive, piezoelectric, piezoresistive, and photoelectric. Wherein the six-dimensional force sensor resistance is the earliest and most mature technology is currently the most widely used type of development. The resistance change of the resistance strain six-dimensional force sensor means of action of force and moment, by measuring the elastic body attached to the strain gauge sensor resulting forces and moments to obtain information. Resistance strain six-axis force sensor, a strain gauge is often distributed on both sides of the beam, two each a bridg...

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Application Information

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IPC IPC(8): G01L5/1627G06N3/04G06N3/08
CPCG01L5/1627G06N3/084G06N3/045
Inventor 胡松钰叶江浩傅建中
Owner ZHEJIANG UNIV
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