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Reinforcing adhesive adsorbing and attaching jig and attaching method

A technology for laminating fixtures and reinforcing glues, which is applied in the orientation of circuit board tools, electrical components, printed circuit components, etc., which can solve the problems of FPC being easily wrinkled and scrapped, low production efficiency, and low alignment accuracy. , to achieve the effect of convenient automatic pick and place FPC, improve accuracy and validity, and improve accuracy

Active Publication Date: 2021-12-21
深圳市鑫达辉软性电路科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the methods of alignment and bonding of reinforcing adhesive tape are mainly automatic alignment and bonding of CCD machines and manual alignment and bonding. In the case of small FPC shipments or special FPC shapes, It is often more cost-effective to use manual alignment and lamination, but manual operation has problems such as low accuracy of alignment and lamination, FPC is easy to wrinkle and scrapped, and production efficiency is not high.

Method used

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  • Reinforcing adhesive adsorbing and attaching jig and attaching method
  • Reinforcing adhesive adsorbing and attaching jig and attaching method
  • Reinforcing adhesive adsorbing and attaching jig and attaching method

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Embodiment Construction

[0026] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0027] Please refer to figure 1 , figure 2 , image 3 , the embodiment of the present invention provides a reinforcing adhesive tape adsorption and bonding jig, which is used in the FPC production process to protect the FPC by reinforcing the FPC to reduce scrapping. The jig includes: used to attach the reinforcing adhesive tape 5 to the The workbench 1 on the FPC4 and the bottom plate 2 used for stabilizing and reinforcing the adsorption and laminating jig connected to the workbench 1 ...

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Abstract

The invention relates to the technical field of FPC production processes, and discloses a reinforcing adhesive adsorbing and attaching jig and an attaching method. The jig comprises a workbench used for attaching reinforcing adhesive paper on an FPC, and a bottom plate connected with the workbench through a supporting column and used for stabilizing the reinforcing adhesive adsorbing and attaching jig; the workbench is provided with a first material carrying area used for carrying the FPC and a second material carrying area used for carrying the reinforcing adhesive paper; the first material carrying area and the second material carrying area are each provided with a plurality of adsorption holes; an adsorption mechanism is arranged on the bottom plate; ad the adsorption mechanism is connected to the lower end of the adsorption holes through vacuum guide pipes and used for enabling the reinforcing adhesive paper to be attached to the FPC through vacuumizing adsorption. By implementing the technical scheme disclosed by the invention, the reinforcing adhesive paper and the FPC can be accurately aligned, and are automatically and flatly attached through vacuum adsorption, so that manual operation is reduced, and the alignment and attach precision and the working efficiency are improved.

Description

technical field [0001] The invention relates to the technical field of FPC production technology, in particular to a jig and a bonding method for the adsorption and bonding of reinforcing adhesive tape. Background technique [0002] FPC (Flexible Printed Circuit) is a flexible printed circuit board, which is popular for its light weight, thin thickness, free bending and folding and other excellent characteristics, but in the production process, the light and thin material is easy to cause damage such as bending deformation , It is necessary to paste reinforcing materials for reinforcement and then enter the follow-up process to protect the FPC, and then tear off the reinforcing materials in the later stage of production. In the prior art, the methods of alignment and bonding of reinforcing adhesive tape are mainly automatic alignment and bonding of CCD machines and manual alignment and bonding. In the case of small FPC shipments or special FPC shapes, It is often more cost-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/02
CPCH05K3/0008H05K1/0281Y02P70/50
Inventor 陈晶昌黄栋黄庆方明
Owner 深圳市鑫达辉软性电路科技有限公司