Electronic element mounting substrate, electronic device, and electronic module
A technology for electronic component installation and electronic components, applied in the direction of electrical components, electrical connection printed components, electrical solid devices, etc., can solve problems such as cracks and reduced substrate strength
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no. 1 approach
[0022] refer to Figure 1 to Figure 9 , the electronic component mounting substrate 1 according to the first embodiment of the present disclosure, and the electronic device 21 including the electronic component mounting substrate will be described. in addition, figure 1 shows a plan view and a cross-sectional view of the electronic device 21, figure 2 A plan view and a cross-sectional view of the electronic module 31 are shown. In addition, in Figure 3 ~ Figure 7 An enlarged vertical cross-sectional view of a main part A of the electronic component mounting substrate 1 is shown in . In addition, in Figure 8 as well as Figure 9 An enlarged plan view and an enlarged cross-sectional view of a main part A of the electronic component mounting substrate 1 are shown in .
[0023] The electronic component mounting substrate 1 has a first layer 2a, a second layer 2b located on the lower surface of the first layer 2a, and a third layer 2c located on the lower surface of the se...
no. 2 approach
[0082] Next, refer to Figure 10 The electronic component mounting substrate 1 according to the second embodiment of the present disclosure will be described.
[0083] In the substrate 1 for mounting electronic components of this embodiment, the difference from the substrate 1 for mounting electronic components of the first embodiment is that there is another insulating layer 2d between the first conductor layer 6 and the second conductor layer 7; The first void portion 6c and the second void portion 7c do not overlap when seen from above.
[0084] exist Figure 10 In the shown example, the substrate 2 of the electronic component mounting substrate 1 has another insulating layer 2d between the first layer 2a and the second layer 2b, and the second conductor layer 7 is located between the other insulating layer 2d and the second layer 2b. . In other words, another insulating layer 2 d is further added between the first conductor layer 6 and the second conductor layer 7 . In...
no. 3 approach
[0087] Next, refer to Figure 11 The electronic component mounting substrate 1 according to the third embodiment of the present disclosure will be described.
[0088] In the substrate 1 for mounting electronic components of this embodiment, the difference from the substrate 1 for mounting electronic components of the first embodiment is that the substrate 2 has a third conductor layer 8; the first cavity 6c, the second cavity 7c And the third void portion 8c is located at a separate position when viewed from above.
[0089] exist Figure 11 In the example shown, the substrate 2 has the third conductor layer 8 , and the first void portion 6 c , the second void portion 7 c and the third void portion 8 c are located at separate positions in a perspective plan view. Here, like the first conductor layer 6 and the second conductor layer 7, the third conductor layer 8 has a third land portion 8a surrounding the via conductor 5, and a third land portion 8a surrounding the third land...
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Abstract
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