Application of conductive thermosetting resin composition

Abstract

The invention provides an application of a conductive thermosetting resin composition and belongs to the field of semiconductor packaging. The composition comprises (a) silver particles, (b) copper powder, (c) acrylic resin, (d) a solvent, (e) a fluxing agent, (f) a free radical initiator and (I) a titanate coupling agent. the particle size of (a) is 0.1-10 [mu] m, and the thickness is 10-100 nm; the particle size of (b) is 1-5 [mu] m, and the thickness is 10-100 nm; with the total amount of (a) and (b) taken as 100 parts by mass, 5-10 parts by mass of (c), 3-5 parts by mass of (d), 0.1-0.5 part by mass of (e), and 0.05-0.2 part by mass of (I) are adopted; and with the total mass of (c) taken as 100 parts by mass, 4-7 parts by mass of(f) is adopted. The conductive thermosetting resin composition provided by the invention can reduce or even eliminate the bonding defect of a chip and the surface of a substrate, improve the bonding force of the chip and the substrate, and ensure the reliability of a semiconductor device.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to the application of a conductive thermosetting resin composition. Background technique [0002] With the rapid development of semiconductor and chip technology, chips are being miniaturized, and the requirements for the bonding strength and reliability of conductive silver adhesive are higher. As the chip becomes smaller, the area that can be used for bonding is naturally reduced. Due to the reduction of the bonding area, the absolute strength of the bond will generally decrease, which in turn will lead to a decrease in the bonding strength between the chip and the substrate. [0003] In particular, the high brightness of white light-emitting LEDs in recent years has also been widely used in lighting devices such as backlighting of full-color liquid crystal screens, chandeliers, and downlights. However, due to high current input due to higher output of light-emitt...

AI Technical Summary

Problems solved by technology

However, due to high current input due to higher output of light-emitting elements, there is a problem that the adhesive that bonds the light-emitting element and the substrate will change color due to heat or light, or the resistance value will change over time.

In particular, in a method in which the bonding is completely dependent on the adhesive force of the adhesive, the bonding material may lose its adhesive force at the melting temperature of the solder and peel off at the time of solder mounting of electronic components, resulting in a fatal problem of non-luminescence.

[0004] In related technologies, when there is slight stress / thermal stress, the bonding defects on the surface of the substrate are more likely to cause light-emitting components to not emit light

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