Carrier for heating test of electronic device

A technology for electronic devices and carriers, applied in the field of electronic device heating test carriers, can solve the problems of increasing the time and cost of testing electronic devices, failing to timely feedback the temperature of electronic devices, and low temperature control accuracy, and reducing time and heating time. Short, small size effect

Pending Publication Date: 2022-01-11
重庆平创半导体研究院有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method can complete the heating test of the electronic device, but in the process of heating the entire box, it needs a long process of heating and constant temperature, and heating the entire box, there are problems of low temperature control accuracy and inability to timely feedback the temperature of the electronic device Problem; In addition, during the heating process, the position occupied by the electronic device in the box is small, and the effective work required to heat the electronic device is much smaller than the heat required to heat the entire thermostat box, resulting in a large amount of energy waste. Increased time and cost of testing electronics

Method used

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  • Carrier for heating test of electronic device
  • Carrier for heating test of electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Embodiment 1 is basically as attached figure 1 Shown:

[0035] An electronic device heating test carrier, such as figure 1 , figure 2 As shown, it includes a carrier 1 , a heating device, a temperature sensor 2 , a humidity sensor 4 , a controller 5 , a test base 6 and a substrate 3 . The carrier 1 , the temperature sensor 2 , the humidity sensor 4 and the controller 5 are all arranged on the substrate 3 .

[0036] The carrier 1 is used to load the device to be tested, and when it is necessary to conduct an electronic device test, the device to be tested is fixedly connected to the carrier 1 . In this embodiment, the way of fixed connection is welding. In other embodiments of the present application, the device under test may also be fixed on the carrier 1 by using special adhesive for electronic components.

[0037] The heating device includes a heating top plate and a heating bottom plate, and the heating top plate and the heating bottom plate are used to clamp a...

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PUM

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Abstract

The invention relates to the technical field of device testing equipment, in particular to a carrier for heating test of an electronic device. The carrier comprises: a carrier body, which is used for loading a device to be tested; a heating device, which comprises a heating top plate and a heating bottom plate, wherein the heating top plate and the heating bottom plate are used for clamping and heating the carrier body and the device to be tested; a temperature sensor, which is used for collecting the temperature of the carrier body and sending the temperature to the controller; and a controller, which is used for controlling the heating power of the heating device according to the temperature collected by the temperature sensor. By adopting the above scheme, the time and the cost of testing the electronic device can be reduced, the control precision of the heating temperature is improved, and the speed of reflecting the temperature condition of the to-be-tested device is accelerated.

Description

technical field [0001] The invention relates to the technical field of device testing equipment, in particular to a heating test carrier for electronic devices. Background technique [0002] In order to ensure that electronic devices can work normally in high temperature environments, electronic devices are generally tested in high temperature environments. At present, when conducting temperature-related tests on electronic devices in the market, the method used is to put the electronic devices into a constant temperature heating box, and then test them in a set temperature-changing environment. This method can complete the heating test of the electronic device, but in the process of heating the entire box, it needs a long process of heating and constant temperature, and heating the entire box, there are problems of low temperature control accuracy and inability to timely feedback the temperature of the electronic device Problem; In addition, during the heating process, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00G01R1/04
CPCG01R31/003G01R1/0408
Inventor 周松陈显平孙志飞
Owner 重庆平创半导体研究院有限责任公司
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