Back adhesive film stripping device of bracelet production line LED module assembling machine

Abstract

The invention discloses a back adhesive film stripping device of a bracelet production line LED module assembling machine. The back adhesive film stripping device comprises a first support, an inclined sliding table cylinder, an L-shaped plate, a longitudinal sliding table cylinder, a lower film stripping handle, an upper film stripping handle, a tooth surface, a second support, a lifting cylinder, a finger cylinder and a clamp, wherein the inclined sliding table cylinder is arranged on the first support, the L-shaped plate is arranged on the inclined sliding table cylinder, the longitudinal sliding table cylinder and the lower film stripping handle are arranged on the two faces of the L-shaped plate respectively, and the upper film stripping handle is arranged on the longitudinal sliding table cylinder. Through the mode, the back adhesive film stripping device of the bracelet production line LED module assembling machine provided by the invention aims at the problems that the manual film stripping efficiency is low and the labor intensity is high, adopts a mode that the film stripping handles are matched with the inclined sliding table cylinders to automatically realize an LED module back adhesive film stripping procedure, and protects a structural adhesive between LED modules from being damaged by a film tearing action through adopting the clamp with steps while the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of smart bracelet assembly equipment, in particular to a back adhesive film peeling device of an LED module assembly machine in a bracelet production line. Background technique [0002] The LED module of the wristband is composed of the LED bottom cover on the lower layer and the LED FPC on the upper layer. Before the gluing operation, the adhesive film at the bottom of the LED bottom cover needs to be torn off. The traditional film tearing operation uses manual or negative pressure suction head to grab the LED module, which is inefficient and labor-intensive; if the negative pressure suction head is used to grab and fix the LED module, it will form a The external pulling force will destroy the existing adhesive structure between the LED bottom cover and the LED FPC, and reduce the bonding fastness between the LED bottom cover and the LED FPC. Contents of the invention [0003] The technical problem mainly solved ...

AI Technical Summary

Problems solved by technology

[0003] The technical problem mainly solved by the present invention is to provide a back adhesive film peeling device of the LED module assembly machine of the bracelet production line. The method of cooperation automatically realizes the peeling process of the LED module back adhesive film, which improves the production efficiency and at the same time adopts the fixture with steps to protect the structural adhesive between the LED modules from being damaged by the tearing action.

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