Temperature measuring device

A temperature measurement and measurable technology, applied in the direction of measuring devices, thermometers, measuring electricity, etc., can solve problems such as expansion of installation space, increase in cost, increase in the number of parts, etc., and achieve the effect of reducing the number of parts and stably measuring temperature

Pending Publication Date: 2022-03-01
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when such a mechanism is adopted, the number of parts increases
Therefore, not only the assembly man-hours increase, but also the installation space increases, leading to an increase in cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0044] refer to Figures 5A-5B as well as Figures 6A-6C , the temperature measuring device according to Embodiment 1 will be described. Figures 5A-5B It is a schematic cross-sectional view of the voltage monitoring device 100 in the vicinity of the temperature measuring device according to the first embodiment. Figures 5A-5B A cross-section obtained when the voltage monitoring device 100 and the battery 210 are cut along the longitudinal direction of the battery 210 is schematically shown near where the temperature measuring device is installed. in addition, Figure 5A A state in which the voltage monitoring device 100 is fixed to the battery pack 200 (battery 210 ) is shown. Figure 5B The voltage monitoring device 100 fixed to the battery pack 200 is shown. Figures 6A-6C It is a schematic configuration diagram of the temperature measuring device according to the first embodiment. also, Figure 6A is a top view of the temperature measuring device. Figure 6B yes ...

Embodiment approach 2

[0053] Figures 7A-7C This embodiment 2 is shown. In this embodiment, the structure of the temperature measurement device different from that of the above-mentioned first embodiment is shown. The basic structure and function are the same as those of Embodiment 1. Therefore, the same reference numerals are given to the same components, and descriptions thereof will be omitted.

[0054] Figures 7A-7C It is a schematic configuration diagram of the temperature measuring device according to the second embodiment. also, Figure 7A is a top view of the temperature measuring device. Figure 7B yes Figure 7A AA sectional view in, Figure 7C yes Figure 7A The BB cross section in .

[0055] In this embodiment, only temperature measurement device 140A has a different configuration from temperature measurement device 140 of Embodiment 1 described above. The other configurations of the cover 120 and the like are the same as those of the first embodiment described above. Theref...

Embodiment approach 3

[0060] Figures 8A-8C Embodiment 3 of this invention is shown. In this embodiment, the structure of the temperature measurement device different from that of the above-mentioned first embodiment is shown. The basic structure and function are the same as those of Embodiment 1. Therefore, the same reference numerals are given to the same components, and descriptions thereof will be omitted.

[0061] Figures 8A-8C A schematic configuration diagram showing a temperature measuring device according to Embodiment 3 of the present invention. also, Figure 8A is a top view of the temperature measuring device. Figure 8B yes Figure 8A AA section view in . Figure 8C yes Figure 8A The BB cross section in .

[0062] In this embodiment, only the temperature measurement device 140B has a different configuration from the temperature measurement device 140 of the first embodiment described above. The other configurations of the cover 120 and the like are the same as those of the ...

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PUM

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Abstract

The invention provides a temperature measuring device which is composed of a flexible printed wiring board having wiring, a heat-sensitive element, a heat collecting plate and a pressing member, the flexible printed wiring board is mounted on a housing fixed to an object to be measured, the heat-sensitive element is electrically connected with the wiring, the heat collecting plate is electrically connected with the heat collecting plate, and the pressing member is electrically connected with the flexible printed wiring board. And a heat collection plate configured to be pressed at a temperature measurement position of the object to be measured on an opposite side of the heat sensitive element through the flexible printed wiring board, the pressing member being made of a foam material, and the pressing member being compressed when the housing is fixed to the object to be measured, and the heat collection plate being configured to be pressed at the temperature measurement position of the object to be measured on an opposite side of the heat sensitive element through the flexible printed wiring board. And pressing the heat collection plate onto the measured object.

Description

[0001] Cross References to Related Applications [0002] This application is based on Japanese Patent Application No. 2020-133935 filed with the Japan Patent Office on August 6, 2020, and the entire content of said Japanese Patent Application is hereby incorporated by reference. technical field [0003] The invention relates to a temperature measuring device. Background technique [0004] Temperature measuring devices for measuring the temperature of a measured object are known. For example, a battery pack mounted on an electric car or the like is provided with a device for measuring the temperature of the battery pack. The battery contained in the battery pack of such a device needs to be in reliable contact with the heat-sensitive element mounting portion. For example, there is known a method of affixing a thermosensitive element mounting portion with an adhesive tape. However, this method may cause peeling due to deterioration of the adhesive. Therefore, this method l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K1/14G01K1/08G01R31/396G01R31/382
CPCG01K1/14G01K1/08G01R31/396G01R31/382H05K1/189H05K2201/10196H01M10/486G01K1/18Y02E60/10G01K7/22H05K2201/10022G01K1/16H05K1/028
Inventor 渡边司冨田俊辅山田周三木谷健治
Owner NIPPON MEKTRON LTD
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