Method for improving partition alignment efficiency of digital laser direct writing exposure machine

Abstract

The invention discloses a method for improving partition alignment efficiency of a digital laser direct writing exposure machine. The method comprises the following steps: S1, forming a substrate, arranging a plurality of exposure areas on the substrate, and arranging four mark points in rectangular distribution for each exposure area according to a design drawing; s2, for each exposure area, capturing two mark points at opposite angles by using an alignment camera, and virtualizing the remaining two mark points of each exposure area according to the two captured mark points; and for each exposure area, performing alignment exposure according to the two mark points captured by the alignment camera and the two virtualized mark points. According to the method disclosed by the invention, the time for grabbing the mark point can be reduced by half, and the exposure productivity is remarkably improved.

Description

technical field [0001] The invention relates to the technical field of digital laser direct writing exposure, in particular to a method for improving the partition alignment efficiency of a digital laser direct writing exposure machine. Background technique [0002] In the prior art, the laser direct writing exposure machine usually needs to expose according to the alignment of the pre-printed mark points, and generally adopts four-point alignment, and the mark points are distributed at the four vertices of the rectangular figure. When exposing, first use the camera to capture the actual coordinates of the 4 mark points, and the exposure machine will translate and rotate the graphics according to the actual coordinate positions of the mark points before exposing. [0003] In the wafer industry, the exposure area of ​​a die (chip) is small, and multiple dies are usually arrayed and assembled into a large board for exposure. Each die has 4 mark points. When exposing the large...

AI Technical Summary

Problems solved by technology

Taking a 12-inch wafer (304.8mm) as an example, a die area is 15x15mm, and a 15x15 array is formed. There are 900 mark points in 225 areas. It is time-consuming to capture the mark points, which greatly affects the exposure production capacity.

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