Double-color LED and manufacturing process thereof

Abstract

The double-color LED comprises a substrate, a first LED chip, a second LED chip and a cofferdam, the light-emitting surface of the top surface of the first LED chip is provided with a first fluorescent glue layer formed through a dispensing process, and the light-emitting surface of the top surface of the second LED chip is provided with a first fluorescent powder layer formed through a powder spraying process by covering the first LED chip through a cover plate. A first fluorescent glue layer is arranged on the side light-emitting surface of the first LED chip, a second fluorescent glue layer is arranged on the side light-emitting surface of the second LED chip, the first LED chip is matched with the first fluorescent glue to form a first color temperature LED, the second LED chip, the first fluorescent powder layer and the second fluorescent glue layer are matched to form a second color temperature LED, and the cofferdam is filled with a transparent glue layer covering the first color temperature LED and the second color temperature LED. The first LED chip is covered by the cover plate, other positions of the die bonding area are exposed, and the thinner first fluorescent powder layer can be formed on the light-emitting surface of the top surface of the second LED chip after the powder spraying process, so that the problem caused by thick glue at the warm white LED is solved.

Description

technical field [0001] The invention relates to an LED, in particular to a two-color LED and a manufacturing process thereof. Background technique [0002] Traditional two-color COB generally includes a substrate, a first LED chip and a second LED chip. The light-emitting surface of the first LED chip is covered with the first fluorescent glue, and the light-emitting surface of the second LED chip is covered with the second fluorescent glue. Different thicknesses from the second fluorescent glue produce cool and warm color temperatures. At present, due to the thick glue on the warm white chip, the two-color COB is easy to touch the adjacent chips next to the fluorescent glue, so it is not suitable for densely integrated two-color COB; the glue is thicker, and the demand for fluorescent glue will increase, which will undoubtedly increase the production cost; The amount of glue is thick, the glue amount and the shape of the fluorescent glue layer are not easy to control, whic...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a two-color LED and its manufacturing process to solve the problem of thick glue at the warm white temperature LED chip

The principle of the present invention: the first phosphor layer at the second LED chip is formed by a powder spraying process. When spraying powder, the first LED chip is covered by a cover plate, and other positions in the die-bonding area are exposed. After the powder spraying process, it can Form a thinner first phosphor layer on the top light-emitting surface of the second LED chip to solve the problem caused by thick glue at the warm white temperature LED; set a second fluorescent glue layer on the light-emitting surface of the second LED chip , can solve the problem of side light leakage and improve the overall light uniformity; because the amount of glue used in cool white temperature LEDs is small, the first fluorescent glue layer can be formed by dispensing in actual production

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